Issue Date | Title | Author(s) | Source | scopus | WOS | Fulltext/Archive link |
---|---|---|---|---|---|---|
2003 | A Study on the Reaction between Cu and Sn-3.5Ag Solder Doped with Small Amounts of Ni | Tsai, J. Y.; Hu, Y. C.; Tsai, C. M.; Kao, and C. R. | Journal of Electronic Materials | |||
2000 | Using tert-butyl alcohol as an adductive agent for separation of an m-cresol and 2,6-xylenol mixture | Lee, L. S.; Lin, C. W.; Kao, and C. R. | Industrial and Engineering Chemistry Research |