Issue Date | Title | Author(s) | Source | scopus | WOS | Fulltext/Archive link |
---|---|---|---|---|---|---|
2008 | Design of Reflectionless Vias Using Neural Network-Based Approach | Ku-Teng Hsu; Wei-Da Guo; Guang-Hwa Shiue; Chien-Min Lin; TIAN-WEI HUANG ; RUEY-BEEI WU | IEEE Transactions on Advanced Packaging | |||
2005 | Model Extractions of Coupled Bonding-wire Structures in Electronic Packaging | Hao-Geng Lin; Tian-Wei Huang; RUEY-BEEI WU ; Chien-Min Lin; TIAN-WEI HUANG | Asia-Pacific Microwave Conference, APMC |