公開日期 | 標題 | 作者 | 來源出版物 | scopus | WOS | 全文 |
2006 | Rapid whisker growth on the surface of Sn-3Ag-0.5Cu-1.0Ce solder joints | Chuang, T.-H.; TUNG-HAN CHUANG | Scripta Materialia | | | |
2006 | Remotely coupled surface plasmons in a metal/insulator/Si structure perforated with periodic square hole arrays | Chuang, T.-H.; Tsai, M.-W.; Chang, Y.-T.; SI-CHEN LEE | Applied Physics Letters | 13 | 9 | |
2006 | Remotely coupled surface plasmons in a two-colored plasmonic thermal emitter | Chuang, T.-H.; Tsai, M.-W.; Chang, Y.-T.; SI-CHEN LEE | Applied Physics Letters | | | |
2006 | Selective particle separation and deposition by 3-D insulator-based dielectrophoresis | Chuang, K.-C.; Chu, L.-Y.; Jiang, M.-S.; Chuang, T.-H.; Fu, C.-C.; Fan, S.-K.; SHIH-KANG FAN | 10th International Conference on Miniaturized Systems for Chemistry and Life Sciences | | | |
2020 | Study on thermoelectric property optimization of mixed-phase bismuth telluride thin films deposited by co-evaporation process | Wu, Y.-J.; Hsu, S.-C.; Lin, Y.-C.; Xu, Y.; Chuang, T.-H.; Chen, S.-C.; TUNG-HAN CHUANG | Surface and Coatings Technology | | | |
2013 | Surface reconstruction of an annealing twinned Ag-8Au-3Pd alloy wire under current stressing | Chuang, T.-H.; Wang, H.-C.; Chuang, C.-H.; Lin, H.-J.; Lee, J.-D.; Tsai, H.-H.; TUNG-HAN CHUANG | Metallurgical and Materials Transactions A: Physical Metallurgy and Materials Science | | | |
2009 | The proximity between C-termini of dimeric vacuolar H+- pyrophosphatase determined using atomic force microscopy and a gold nanoparticle technique | Liu, T.-H.; Hsu, S.-H.; Huang, Y.-T.; Lin, S.-M.; Huang, T.-W.; Chuang, T.-H.; Fan, S.-K.; Fu, C.-C.; Tseng, F.-G.; Pan, R.-L.; SHIH-KANG FAN | FEBS Journal | | | |
2014 | Thermal stability of grain structure and material properties in an annealing twinned Ag-4Pd alloy wire | Chuang, T.-H.; Lin, H.-J.; Chuang, C.-H.; Shiue, Y.-Y.; Shieu, F.-S.; Huang, Y.-L.; Hsu, P.-C.; Lee, J.-D.; Tsai, H.-H.; TUNG-HAN CHUANG | Journal of Alloys and Compounds | | | |
2012 | Thermal stability of grain structure and material properties in an annealing-twinned Ag-8Au-3Pd alloy wire | Chuang, T.-H.; Wang, H.-C.; Tsai, C.-H.; Chang, C.-C.; Chuang, C.-H.; Lee, J.-D.; Tsai, H.-H.; TUNG-HAN CHUANG | Scripta Materialia | | | |
2007 | Transmission through randomly arranged microcells of subwavelength holes on an aluminum film | Chang, Y.-T.; Chuang, T.-H.; Yang, C.-H.; Tsai, M.-W.; SI-CHEN LEE | Applied Physics Letters | 4 | 8 | |
2020 | Ultrasonic Bonding of Ag and Ag-Alloy Ribbon - An Innovative Alternative for High Power IC Packages | Chen, C.-H.; Lin, Y.-C.; Groth, A.; Lai, Y.-C.; Lin, C.-Y.; Chang, H.-M.; Chuang, T.-H.; TUNG-HAN CHUANG | IEEE Transactions on Components, Packaging and Manufacturing Technology | | | |