| Issue Date | Title | Author(s) | Source | scopus | WOS | Fulltext/Archive link |
| 2019 | Abnormal Cu3Sn growth through grain boundary penetration in space-confined Ni-Sn-Cu diffusion couples | Wang Y.W.; Zhu Z.X.; Shih W.L.; Kao C.R.; C. ROBERT KAO | Journal of Alloys and Compounds | 6 | 6 | |
| 2023 | Additive-induced crystallization of highly (111) textured Cu nanotwins by electroless deposition | Shih, P. S.; Huang, C. H.; C. ROBERT KAO | Journal of Alloys and Compounds | 1 | | |
| 2014 | Amorphous Pd layer as a highly effective oxidation barrier for surface finish of electronic terminals | Li C.C.; Shih W.L.; Chung C.K.; Kao C.R.; C. ROBERT KAO | Corrosion Science | 7 | 6 | |
| 2018 | Analyses and design for electrochemical migration suppression by alloying indium into silver | Yang C.A.; Wu J.; Lee C.C.; Kao C.R.; C. ROBERT KAO | Journal of Materials Science: Materials in Electronics | 9 | 10 | |
| 2011 | Analysis and experimental verification of the competing degradation mechanisms for solder joints under electron current stressing | Ke J.H.; Yang T.L.; Lai Y.S.; C. ROBERT KAO | Acta Materialia | 54 | 52 | |
| 2008 | Analysis and experimental verification of the volume effect in the reaction between zn-doped solders and cu | Yang S.C.; Wang Y.W.; CHIEN-CHENG CHANG ; C. ROBERT KAO | Journal of Electronic Materials | 18 | 18 | |
| 1994 | Application of Thermodynamics, Phase-Equilibria and Kinetics to in-Situ Composite Synthesis Via Ternary Solid-State Displacement-Reactions | Chang, Ya; Kao, Cr; C. ROBERT KAO | Pure and Applied Chemistry | 16 | 14 | |
| 2023 | Artifact-Free Microstructures in the Interfacial Reaction between Eutectic In-48Sn and Cu Using Ion Milling | Chang, Fu Ling; Lin, Yu Hsin; Hung, Han Tang; Kao, Chen Wei; C. ROBERT KAO | Materials | 0 | 0 | |
| 2020 | Artifact-free microstructures of the Cu-In reaction by using cryogenic broad argon beam ion polishing | Hung H.T; Lee P.T; Tsai C.H; Kao C.R.; C. ROBERT KAO | Journal of Materials Research and Technology | 7 | 6 | |
| 2013 | Assembly of N type Bi2(Te, Se)3 thermoelectric modules by low temperature bonding | Li C.C.; Zhu Z.X.; Liao L.L.; Dai M.J.; Liu C.K.; Kao C.R.; C. ROBERT KAO | Science and Technology of Welding and Joining | 7 | 7 | |
| 2013 | Au and Pd embrittlement in space-confined soldering reactions for 3D IC applications | Chen Y.J.; Huang K.Y.; Chen H.T.; Kao C.R.; C. ROBERT KAO | International Symposium on Advanced Packaging Materials | 5 | 0 | |
| 2016 | Au-Sn bonding material for the assembly of power integrated circuit module | Zhu Z.X.; Li C.C.; Liao L.L.; Liu C.K.; Kao C.R.; C. ROBERT KAO | Journal of Alloys and Compounds | 80 | 76 | |
| 2022 | Bifunctional Nanocomposites Based on SiO2/NiS2 Combination for Electrochemical Sensing and Environmental Catalysis | Renganathan V; Balaji R; Chen S.-M; Chandrasekar N; Maheshwaran S; Kao C.R.; C. ROBERT KAO | Electroanalysis | 1 | 1 | |
| 1999 | Binary compounds in the Ge-Ti system | Jain T.A.; Kao C.R.; C. ROBERT KAO | Journal of Alloys and Compounds | 11 | 11 | |
| 2018 | Bonding of copper pillars using electroless Au plating | Weng I.A.; Hung H.T.; Yang S.; Chen Y.H.; Kao C.R.; C. ROBERT KAO | 2018 International Conference on Electronics Packaging and iMAPS All Asia Conference | 5 | 0 | |
| 2019 | Bonding of Copper Pillars Using Electroless Cu Plating | Kao L.Y.; Hung H.T.; Chen Y.H.; Kao C.R.; C. ROBERT KAO | 2019 International Conference on Electronics Packaging | 7 | 0 | |
| 2016 | Bonding of copper pillars using electroless Ni plating | Yang S.; Hung H.T.; Chen Y.B.; Kao C.R.; C. ROBERT KAO | 2016 International Conference on Electronics Packaging | 3 | 0 | |
| 1997 | Calculation of low-temperature phase equilibria in the indium-lead system | Kao C.R.; C. ROBERT KAO | Journal of the Chinese Institute of Engineers, Transactions of the Chinese Institute of Engineers,Series A/Chung-kuo Kung Ch'eng Hsuch K'an | 1 | 1 | |
| 2003 | Chemical reaction in solder joints of microelectronic packages | Ho C.E.; Lin Y.L.; Tsai J.Y.; Kao C.R.; C. ROBERT KAO | Journal of the Chinese Institute of Chemical Engineers | 7 | | |
| 2017 | Chip-to-Chip Direct Interconnections by Using Controlled Flow Electroless Ni Plating | Hung H.T.; Yang S.; Chen Y.B.; Kao C.R.; C. ROBERT KAO | Journal of Electronic Materials | 20 | 16 | |
