公開日期 | 標題 | 作者 | 來源出版物 | scopus | WOS | 全文 |
2018 | Advanced run-to-run controller in semiconductor manufacturing with real-time equipment condition: APC: Advanced process control; AM: Advanced metrology | Yang, W.-T.; Blue, J.; Roussy, A.; Reis, M.; Pinaton, J.; JAKEY BLUE | 2018 29th Annual SEMI Advanced Semiconductor Manufacturing Conference | | | |
2018 | Automatic equipment fault fingerprint extraction for the fault diagnostic on the batch process data | Rostami, H.; Blue, J.; Yugma, C.; JAKEY BLUE | Applied Soft Computing Journal | | | |
2019 | Chamber Mismatching Calibration with Adjusted Run-to-Run Regulation in Semiconductor Manufacturing | Chouichi A; Blue J; Yugma C; Pasqualini F.; JAKEY BLUE | Proceedings - 2019 IEEE International Conference on Smart Manufacturing, Industrial and Logistics Engineering, SMILE 2019 | | | |
2020 | Chamber-to-Chamber Discrepancy Detection in Semiconductor Manufacturing | Aabir Chouichi; JAKEY BLUE ; Claude Yugma; Francois Pasqualini | IEEE Transactions on Semiconductor Manufacturing | 9 | 7 | |
2007 | Demand planning approaches to aggregating and forecasting interrelated demands for safety stock and backup capacity planning | Chen, Argon ; Hsu, C.-H.; JAKEY BLUE | International Journal of Production Research | 18 | 13 | |
2019 | The detection and the control of machine/chamber mismatching in semiconductormanufacturing | Chouichi, A.; Blue, J.; Yugma, C.; Pasqualini, F.; JAKEY BLUE | Winter Simulation Conference | | | |
2017 | Device pattern impact on optical endpoint detection by interferometry for STI CMP | Bourzgui S; Roussy A; Blue J; Georges G; Faivre E; Labory K; Allard A.; JAKEY BLUE | ICPT 2017 - International Conference on Planarization/CMP Technology | | | |
2012 | Efficient FDC based on hierarchical tool condition monitoring scheme | Blue, J.; Roussy, A.; Thieullen, A.; Pinaton, J.; JAKEY BLUE | ASMC (Advanced Semiconductor Manufacturing Conference) | | | |
2017 | Equipment condition diagnosis and fault fingerprint extraction in semiconductor manufacturing | Rostami, H.; Blue, J.; Yugma, C.; JAKEY BLUE | 2016 15th IEEE International Conference on Machine Learning and Applications | | | |
2021 | Equipment deterioration modeling and cause diagnosis in semiconductor manufacturing | Rostami H; Blue J; Chen A; ARGON CHEN ; JAKEY BLUE | International Journal of Intelligent Systems | 4 | 4 | |
2018 | Equipment Deterioration Modeling and Causes Diagnosis in Semiconductor Manufacturing | Rostami, H.; Blue, J.; Chen, A.; ARGON CHEN ; JAKEY BLUE | IEEE International Conference on Automation Science and Engineering | 0 | 0 | |
2014 | FDC R2R variation monitoring for sensor level diagnosis in tool condition hierarchy | Blue, J.; Roussy, A.; Pinaton, J.; JAKEY BLUE | ASMC (Advanced Semiconductor Manufacturing Conference) | | | |
2017 | Generalized Overall Equipment Effectiveness for integrated scheduling and process control | Kao, Y.-T.; Chang, S.-C.; Blue, J.; JAKEY BLUE ; SHI-CHUNG CHANG | IEEE International Symposium on Semiconductor Manufacturing Conference Proceedings | 0 | 0 | |
2018 | Heterogranular multivariate analytics for detecting and controlling the root causes of the mismatching machines in semiconductor manufacturing | Chouichi, A.; Blue, J.; Yugma, C.; Pasqualini, F.; JAKEY BLUE | 2018 29th Annual SEMI Advanced Semiconductor Manufacturing Conference | | | |
2018 | Impact of integrating equipment health in production scheduling for semiconductor fabrication | Kao, Y.-T.; Dauzère-Pérès, Stéphane; JAKEY BLUE ; SHI-CHUNG CHANG | Computers and Industrial Engineering | 23 | 20 | |
2014 | Integration of scheduling and advanced process control in semiconductor manufacturing: Review and outlook | Yugma, C.; Blue, J.; Dauzere-P?r?s, S.; Vialletelle, P.; JAKEY BLUE | IEEE International Conference on Automation Science and Engineering | | | |
2015 | Integration of scheduling and advanced process control in semiconductor manufacturing: review and outlook | Yugma, C.; Blue, J.; Dauz?re-P?r?s, S.; Obeid, A.; JAKEY BLUE | Journal of Scheduling | | | |
2017 | Key Effects and Process Parameters Extraction on the CD of Reactive Ion Etching (RIE) Based on DOE Modeling | Rizquez, M.; Roussy, A.; Blue, J.; Bucelle, L.; Pinaton, J.; Pasquet, J.; JAKEY BLUE | IEEE Transactions on Semiconductor Manufacturing | | | |
2018 | The light behavior from shallow trench isolation profiles at chemical mechanical planarization step and correlation with optical endpoint system by interferometry | Bourzgui, S.; Georges, G.; Roussy, A.; Blue, J.; Faivre, E.; Pinaton, J.; JAKEY BLUE | Proceedings of SPIE - The International Society for Optical Engineering | | | |
2016 | Opportunity for improving fab effectiveness by predictive overall equipment effectiveness (POEE) | Kao, Y.-T.; Chang, S.-C.; Dauzere-Peres, S.; Blue, J.; JAKEY BLUE | e-Manufacturing and Design Collaboration Symposium 2016 | | | |