公開日期 | 標題 | 作者 | 來源出版物 | scopus | WOS | 全文 |
0 | Common mode noise suppression circuit | Iat In Ao Ieong; Chung-Hao Tsai; Tzong-Lin Wu; TZONG-LIN WU | | | | |
2018 | A Common-Mode Filter with Three Alterable and Designable Transmission Zeroes | C.-H. Cheng; T.-L. Wu; TZONG-LIN WU | International Symposium on Electromagnetic Compatibility (EMC EUROPE) | 0 | 0 | |
2016 | Compact Cascaded-Spiral-Patch EBG Structure for Broadband SSN Mitigation in WLAN Applications | C.-K. Shen; S. Chen; T.-L. Wu; TZONG-LIN WU | IEEE Transactions on Microwave Theory and Techniques | 19 | 16 | |
2015 | Compact Hybrid Open Stub EBG Structure for Power Noise Suppression in WLAN Band | C.-K. Shen; T.-L. Wu; TZONG-LIN WU | Joint IEEE Int. Symp. Electromag. Compat. and EMC Europe | 4 | 0 | |
2019 | Compact quasi-elliptic bandpass filter using magnetically coupled LC resonator pair | Lin, T.-Y.; Wu, T.-L.; TZONG-LIN WU | Asia-Pacific Microwave Conference Proceedings, APMC | 0 | 0 | |
2022 | A Compact Symmetrical Single-Cell Bidirectional Absorption Common-Mode Filter | Liu H.-W; Cheng C.-H; TZONG-LIN WU | IEEE Transactions on Components, Packaging and Manufacturing Technology | 3 | 4 | |
2013 | Compact TSV-based wideband bandpass filters on 3-D IC | Y.-C. Tseng; P.-S. Chen; W.-C. Lo; S.-H. Wu; T.-L. Wu; TZONG-LIN WU | IEEE 63rd Electronic Components and Technology Conference | 7 | 0 | |
2015 | Compact Wideband Balanced Filter for Eliminating Radio-Frequency Interference on Differentially-fed Antennas | Y.-C. Tseng; P.-Y. Weng; T.-L. Wu; TZONG-LIN WU | Joint IEEE Int. Symp. Electromag. Compat. and EMC Europe | 4 | 0 | |
2010 | Conformal shielding investigation for SiP modules | C.-H. Huang; C.-Y. Hsiao; C.-D Wang; T. Chen; K.-H. Liao; T.-L. Wu; TZONG-LIN WU | Elect. Design Adv. Packag. Systems Symp. | 13 | 0 | |
2020 | A cost-efficient air-filled substrate integrated ridge waveguide for mmWave application | Ting, C.-W.; Chen, S.; TZONG-LIN WU | IEEE MTT-S International Microwave Symposium Digest | 1 | 0 | |
2003 | Coupling effect of ground bounce noise for ball grid array (BGA) package mounted on printed circuit boards (PCB) | S.-T. Chen; C.-W. Tsai; S.-M. Wu; C.-P. Hung; T.-L. Wu; TZONG-LIN WU | Taiwan Electromagn. Compat. Conf. | | | |
2002 | Coupling of the ground bounce noise to the signal trace with via transition in partitioned power bus of PCB | J.-N. Hwang; T.-L. Wu; TZONG-LIN WU | IEEE Int. Symp. Electromagn. Compat. | 25 | | |
2001 | Crosstalk characterization of high-speed interconnects in time-domain | C.-C. Kuo; Y.-H. Lin; T.-L. Wu; TZONG-LIN WU | IEEE Int. Symp. Electromagn. Compat. | 3 | | |
0 | Defected ground structure with shielding effect | Yu-Hao Hsu; Chung-Hao Tsai; Tzong-Lin Wu; TZONG-LIN WU | | | | |
2019 | Design and analysis of an ultraminiaturized frequency selective surface with two arbitrary stopbands | Wei, P.-S.; Chiu, C.-N.; Wu, T.-L.; TZONG-LIN WU | IEEE Transactions on Electromagnetic Compatibility | 31 | 27 | |
2023 | Design and Analysis of Broadband Power Delivery Network Noise Absorber for Parallel-Plate Mode Suppression | Huang, Li Ching; TZONG-LIN WU | IEEE Transactions on Microwave Theory and Techniques | 0 | 0 | |
2010 | Design and implementation of a novel hybrid photonic crystal power/ground layer for broadband power noise suppression | G.-Z. Wu; Y.-C. Chen; T.-L. Wu; TZONG-LIN WU | IEEE Transactions on Advanced Packaging | 18 | 13 | |
2019 | Design and Modeling of a Compact Partially Transmissible Resistor-Free Absorptive Frequency Selective Surface for Wi-Fi Applications | Lin, C.-W.; Shen, C.-K.; Chiu, C.-N.; TZONG-LIN WU | IEEE Transactions on Antennas and Propagation | 7 | 6 | |
2009 | Design and modeling of a stopband-enhanced EBG structure using ground surface perturbation lattice for power/ground noise suppression | T.-K. Wang; C.-Y. Hsieh; H.-H. Chuang; T. L. Wu; TZONG-LIN WU | IEEE Transactions on Microwave Theory and Techniques | 48 | 40 | |
2016 | Design and Modeling of an Absorptive Frequency Selective Surface with Several Transmissive Bands | C.-W. Lin; C.-K. Shen; T.-L. Wu; TZONG-LIN WU | IEEE Electrical Design of Advanced Packaging and Systems (EDAPS) | 2 | 0 | |