公開日期 | 標題 | 作者 | 來源出版物 | scopus | WOS | 全文 |
2010 | Conformal shielding investigation for SiP modules | C.-H. Huang; C.-Y. Hsiao; C.-D Wang; T. Chen; K.-H. Liao; T.-L. Wu; TZONG-LIN WU | Elect. Design Adv. Packag. Systems Symp. | 13 | 0 | |
2020 | A cost-efficient air-filled substrate integrated ridge waveguide for mmWave application | Ting, C.-W.; Chen, S.; TZONG-LIN WU | IEEE MTT-S International Microwave Symposium Digest | 1 | 0 | |
2003 | Coupling effect of ground bounce noise for ball grid array (BGA) package mounted on printed circuit boards (PCB) | S.-T. Chen; C.-W. Tsai; S.-M. Wu; C.-P. Hung; T.-L. Wu; TZONG-LIN WU | Taiwan Electromagn. Compat. Conf. | | | |
2002 | Coupling of the ground bounce noise to the signal trace with via transition in partitioned power bus of PCB | J.-N. Hwang; T.-L. Wu; TZONG-LIN WU | IEEE Int. Symp. Electromagn. Compat. | 25 | | |
2001 | Crosstalk characterization of high-speed interconnects in time-domain | C.-C. Kuo; Y.-H. Lin; T.-L. Wu; TZONG-LIN WU | IEEE Int. Symp. Electromagn. Compat. | 3 | | |
0 | Defected ground structure with shielding effect | Yu-Hao Hsu; Chung-Hao Tsai; Tzong-Lin Wu; TZONG-LIN WU | | | | |
2019 | Design and analysis of an ultraminiaturized frequency selective surface with two arbitrary stopbands | Wei, P.-S.; Chiu, C.-N.; Wu, T.-L.; TZONG-LIN WU | IEEE Transactions on Electromagnetic Compatibility | 31 | 27 | |
2023 | Design and Analysis of Broadband Power Delivery Network Noise Absorber for Parallel-Plate Mode Suppression | Huang, Li Ching; TZONG-LIN WU | IEEE Transactions on Microwave Theory and Techniques | 0 | 0 | |
2010 | Design and implementation of a novel hybrid photonic crystal power/ground layer for broadband power noise suppression | G.-Z. Wu; Y.-C. Chen; T.-L. Wu; TZONG-LIN WU | IEEE Transactions on Advanced Packaging | 18 | 13 | |
2019 | Design and Modeling of a Compact Partially Transmissible Resistor-Free Absorptive Frequency Selective Surface for Wi-Fi Applications | Lin, C.-W.; Shen, C.-K.; Chiu, C.-N.; TZONG-LIN WU | IEEE Transactions on Antennas and Propagation | 7 | 6 | |
2009 | Design and modeling of a stopband-enhanced EBG structure using ground surface perturbation lattice for power/ground noise suppression | T.-K. Wang; C.-Y. Hsieh; H.-H. Chuang; T. L. Wu; TZONG-LIN WU | IEEE Transactions on Microwave Theory and Techniques | 48 | 40 | |
2016 | Design and Modeling of an Absorptive Frequency Selective Surface with Several Transmissive Bands | C.-W. Lin; C.-K. Shen; T.-L. Wu; TZONG-LIN WU | IEEE Electrical Design of Advanced Packaging and Systems (EDAPS) | 2 | 0 | |
2010 | Design and modelling of miniaturized bandgap structure for wideband GHz-noise suppression based on LTCC technology | W.-Y. Huang; T.-K. Wang; T.-L. Wu; TZONG-LIN WU | IEEE Transactions on Advanced Packaging | 1 | 1 | |
2012 | Design considerations for radio frequency 3DICs | Y.-C. Tseng; C.-B. Chang; C.-K. Tang; C.-H. Cheng; Y.-C. Lu; K.-Y. Lin; T.-L. Wu; R.-B. Wu; YI-CHANG LU ; TZONG-LIN WU ; RUEY-BEEI WU ; KUN-YOU LIN | IEEE Elect. Design Adv. Packag. Systems Symp. | 0 | 0 | |
2019 | Design of a Broadband Common-Mode Filter with Four Transmission Zeros | Chan, C.-K.; Cheng, C.-H.; Wu, T.-L.; TZONG-LIN WU | IEEE Transactions on Electromagnetic Compatibility | 10 | 10 | |
2015 | Design of On-Chip Microwave Filters in Integrated Fan-Out Wafer Level Packaging (InFO-WLP) Technology | C.-K. Shen; M.-H. Tsai; H.-N. Chen; C.-P. Jou; Sally Liu; F.-L. Hsueh; T.-L. Wu; TZONG-LIN WU | Asia-Pacific Int. Symp. Electronmagn. Compat. | 1 | 0 | |
2019 | Direct Simulation of the Full-Wave Partial Element Equivalent Circuit Using Standard SPICE [Application Notes] | Chou, C.-C.; Wu, T.-L.; TZONG-LIN WU | IEEE Microwave Magazine | 6 | 6 | |
2018 | Dual-band WLAN MIMO antenna with a decoupling element for full-metallic bottom cover tablet computer applications | Chou, J.-H.; Chang, J.-F.; Lin, D.-B.; Wu, T.-L.; TZONG-LIN WU | Microwave and Optical Technology Letters | 15 | 10 | |
2016 | E shape resonator dualband common mode filter | C.-Y. Lin; T.-L. Wu; TZONG-LIN WU | IEEE 25th Conference on Electrical Performance Of Electronic Packaging And Systems (EPEPS) | 3 | 0 | |
2002 | Effect of carbon-fiber orientation on the EM shielding for the plastic laser module packages | Dai, S.G.; Li, P.L.; Jou, W.S.; Wu, T.L.; Cheng, W.H.; TZONG-LIN WU | Proceedings - Electronic Components and Technology Conference | 1 | 0 | |