公開日期 | 標題 | 作者 | 來源出版物 | scopus | WOS | 全文 |
2023 | An Embedded Common-Mode Filter and Mixed-Mode Scattering Parameters for the MIPI C-PHY Interface | Chien, Yung Chi; Liu, Hsu Wei; Chou, Chiu Chih; TZONG-LIN WU | IEEE Transactions on Electromagnetic Compatibility | | | |
2006 | Embedded power plane with ultra-wide stop-band for simultaneously switching noise on high-speed circuits | T. K. Wang; TZONG-LIN WU | Electronics Letters | 18 | 10 | |
2020 | EMI Reduction Control Based on 8b/10b | Weng, P.-Y.; Chou, C.-C.; TZONG-LIN WU | 2020 IEEE International Symposium on Electromagnetic Compatibility and Signal/Power Integrity, EMCSI 2020 | 0 | 0 | |
2017 | EMI-reduction coding based on 8b/10b | C.-C. Chou; T.-L. Wu; TZONG-LIN WU | IEEE International Symposium on Electromagnetic Compatibility & Signal/Power Integrity (EMCSI) | 2 | 0 | |
2019 | EMI-Reduction Coding Based on 8b/10b | Chou, C.-C.; Weng, S.-S.; Lu, Y.-C.; TZONG-LIN WU ; YI-CHANG LU | IEEE Transactions on Electromagnetic Compatibility | 1 | 1 | |
2019 | Enhanced power and signal integrity through layout optimization of high-speed memory systems | Weng, P.-Y.; Cheng, C.-H.; Wu, T.-L.; Chen, C.-H.; Chen, J.; Kuo, E.; Liao, C.-L.; Mutnury, B.; TZONG-LIN WU | IEEE Electrical Design of Advanced Packaging and Systems Symposium | 1 | 0 | |
1992 | Equivalent circuit of a through via in multi-layer environment | Chang, K.K.; Kuo, C.-N.; Wu, T.-L.; Chen, W.-L.; Wu, R.-B.; TZONG-LIN WU | Electrical Performance of Electronic Packaging, EPEP 1992 | 4 | 0 | |
2021 | Erratum: A fully integrated arbitrary power divider on printed circuit board by a novel SMD-resistor-free isolation network (IEEE Transactions on Components, Packaging and Manufacturing Technology (2020) 10:11 (1889-1901) DOI: 10.1109/TCPMT.2020.3029782) | Chen S; Wu T.-L.; TZONG-LIN WU | IEEE Transactions on Components, Packaging and Manufacturing Technology | 0 | 0 | |
2015 | Estimation Method for Statistical Eye Diagram in a Nonlinear Digital Channel | C.-C. Chou; S.-Y. Hsu; T.-L. Wu; TZONG-LIN WU | IEEE Transactions on Electromagnetic Compatibility | 17 | 17 | |
2011 | Evaluation of magnetic field from varied permutation power transmission line at high technology nano-fab | Y.-L. Song; C. Yu; F.-C. Chuang; Y.-C. Tseng; J.-Y. Zou; S.-K. Hsu; T.-G. Ma; T.-L. Wu; L.-M. Chang; TZONG-LIN WU | Int. Conf. Power Electron. Systems Applications | 3 | 0 | |
2021 | Extraction of Complex Permittivity of Dielectrics on Package from W-band to D-band | Lin Y.-T; Kuo H.-C; Wu P.-I; Jhong M.-F; Pan P.-C; Liu C.-Y; Wang C.-C; TZONG-LIN WU | Proceedings - Electronic Components and Technology Conference | 4 | 0 | |
2021 | Extremely Low-Loss Planar Transition from Hollow Dielectric Waveguide to Printed Circuit Board for Millimeter-Wave Interconnect | Liu C.-Y; Ding H.-E; Wu S.-H; Wu T.-L.; TZONG-LIN WU | IEEE Transactions on Microwave Theory and Techniques | 2 | 2 | |
2021 | Eye Comparison between Unencoded and 128b/130b-encoded NRZ Signals | Weng P.-Y; Chen C.-H; Chen J; Kuo E; Lin E; Chu P; Liao C.-L; Mutnury B; TZONG-LIN WU | EPEPS 2021 - IEEE 30th Conference on Electrical Performance of Electronic Packaging and Systems | 0 | 0 | |
2018 | An eye diagram improvement method using simulation annealing algorithm | P. J. Li; T. L. Wu; TZONG-LIN WU | IEEE 22nd Workshop on Signal and Power Integrity (SPI) | 2 | 0 | |
2012 | Eye prediction of digital driver with power distribution network noise | C.-C. Chou; H.-H. Chuang; S.-H. Weng; C.-K. Cheng; T.-L. Wu; TZONG-LIN WU | IEEE Elect. Performance Electronics Package Systems | 10 | 0 | |
1997 | Fabrication and electromagnetic modeling of fiber-optic coupling devices based on weakly fused tapered structure | H.-C. Chang; C.-W. Wu; T.-L. Wu; S.-W. Yang; G.-J. Liao; TZONG-LIN WU | Taiwan Optoelectron. Ind. Technol. Develop. Conf. | | | |
2018 | Factors affecting near-end crosstalk (NEXT) in high speed serial links | Weng, P.-Y.; Chen, C.-H.; Chen, C.-H.; Liao, C.-L.; Wu, T.-L.; Mutnury, B.; TZONG-LIN WU | 15th International Conference on Electromagnetic Interference and Compatibility, INCEMIC 2018 | 1 | 0 | |
2018 | Fast and accurate yield rate prediction of PCB embedded common-mode filter with artificial neural network | Y. T. Lin; C. H. Cheng; T. L. Wu; TZONG-LIN WU | IEEE International Symposium on Electromagnetic Compatibility and 2018 IEEE Asia-Pacific Symposium on Electromagnetic Compatibility (EMC/APEMC) | 5 | 0 | |
2014 | Fast prediction of radiation from high-speed/high-density connectors | H.-C. Chen; T.-L. Wu; S. Connor; B. Archambeault; TZONG-LIN WU | IEEE. Int. Symp. Electromagn. Compat. | 2 | 0 | |
0 | Filtering device and differential signal transmission circuit capable of suppressing common-mode noises upon transmission of a differential signal | Tzong-Lin Wu; Chung-Hao Tsai; TZONG-LIN WU | | | | |