Issue Date | Title | Author(s) | Source | scopus | WOS | Fulltext/Archive link |
2004 | Low cost and low electromagnetic interference packaging of optical transceiver modules | W.-H. Cheng; W.-C.Hung; C.-H. Lee; G.-L. Hwang; W.-S. Jou; TZONG-LIN WU | Journal of Lightwave Technology(SCI) | 27 | 20 | |
2008 | A low cost dual-CPW differential line for two-layer PCBs | Chi, C.-J.; Chih-Wei, T.; Hsieh, J.-S.; Ko, W.-C.; Wu, T.-L.; TZONG-LIN WU | 2008 Asia-Pacific Symposium on Electromagnetic Compatibility and 19th International Zurich Symposium on Electromagnetic Compatibility, APEMC 2008 | 0 | 0 | |
2012 | Low slow-wave effect and crosstalk for low-cost ABF-coated TSVs in 3-D IC interposer | Chang, Y.-J.; YI-CHANG LU ; TZONG-LIN WU ; YIH-PENG CHIOU et al. | Electronic Components and Technology Conference | 10 | 0 | |
2023 | A Low-Loss Via-Free Ridge Air-Filled Substrate Integrated Waveguide on Printed Circuits Board for mmWave Application | Ting, Cheng Wu; Liu, Hsu Wei; Liao, Chung Hsing; Lee, Chien Cheng; TZONG-LIN WU | IEEE Transactions on Components, Packaging and Manufacturing Technology | 0 | | |
2011 | Magneto-resistive sensor readout circuit and field canceling system in next generation nano-fab | F.-C. Chuang; Y.-L. Song; C. Yu; S.-K. Hsu; T.-L. Wu; L.-M. Chang; TZONG-LIN WU | Asia-Pacific Int. Symp. Electronmagn. Compat. | | | |
2018 | Message from the Incoming Editor-in-Chief | Wu, Tzong-Lin; TZONG-LIN WU | Ieee Transactions on Electromagnetic Compatibility | 0 | 0 | |
2018 | A Miniature Electromagnetic Bandgap Structure Using Integrated Fan-Out Wafer-Level Package (InFO-WLP) for Gigahertz Noise Suppression | M.-H. Tsai; S.-K. Hsu; C.-K. Shen; P.-S. Wei; C.-H. Chern; T.-L. Wu; TZONG-LIN WU | IEEE/MTT-S International Microwave Symposium | 3 | 0 | |
2014 | Miniaturization technique for forward-wave directional couplers by using open stubs and patterned ground structures | S.-K. Hsu; C.-C. Tseng; T.-L. Wu; TZONG-LIN WU | Asia-Pacific Microw. Conference (APMC) | 1 | | |
2014 | Miniaturized and bandwidth-enhanced multilayer 1-D EBG structure for power noise suppression | C.-K. Shen; T.-L. Wu; C.-H. Chen; D.-H. Han; TZONG-LIN WU | IEEE. Int. Symp. Electromagn. Compat. | 6 | 0 | |
2023 | A Miniaturized Balanced-to-Balanced Power Divider with Common-Mode Noise Absorption | Chen, Siang; TZONG-LIN WU | IEEE Transactions on Components, Packaging and Manufacturing Technology | 0 | 0 | |
2020 | Miniaturized Dual-Band FSS Suitable for Curved Surface Application | Wei P.-S; Chiu C.-N; Chou C.-C; Wu T.-L.; TZONG-LIN WU | IEEE Antennas and Wireless Propagation Letters | 25 | 18 | |
2019 | Miniaturized Quarter-Wavelength Resonator for Common-Mode Filter Based on Pattern Ground Structure | Liu, H.-W.; Cheng, C.-H.; Wu, T.-L.; TZONG-LIN WU | 2019 Joint International Symposium on Electromagnetic Compatibility, Sapporo and Asia-Pacific International Symposium on Electromagnetic Compatibility, EMC Sapporo/APEMC 2019 | 1 | 0 | |
2010 | Mitigation of noise coupling in multilayer high-speed PCB: state of the art modeling methodology and EBG technology | T.-L. Wu; J. Fan; F. d. Paulis; C.-D. Wang; A. C. Scogna; A. Orl; i; Wu, Tzong-Lin | IEICE Transactions on Communications | 20 | 13 | |
2019 | A mm-Wave low-loss transition from microstrip line to air-filled substrate integrated wavguide on printed circuit board technology | Ting, C.-W.; Chen, K.-C.; Chen, S.; Wu, T.-L.; TZONG-LIN WU | IEEE Electrical Design of Advanced Packaging and Systems Symposium | 5 | 0 | |
2017 | A modal-analysis-based prediction method for radiation power in differential channels with discontinuity | C. H. Cheng; T. L. Wu; TZONG-LIN WU | International Symposium on Electromagnetic Compatibility - EMC EUROPE | 1 | 0 | |
2013 | Model and mechanism of miniaturized and stopband-enhanced interleaved EBG structure for power/ground noise suppression | C.-D. Wang; T.-L. Wu; TZONG-LIN WU | IEEE Transactions on Electromagnetic Compatibility | 28 | 13 | |
2015 | Modeling and Analysis of Bandwidth-Enhanced Multilayer 1-D EBG With Bandgap Aggregation for Power Noise Suppression | C.-K. Shen; C.-H. Chen; D.-H. Han; T.-L. Wu; TZONG-LIN WU | IEEE Transactions on Electromagnetic Compatibility | 6 | 6 | |
2007 | Modeling noise coupling between package and PCB power/ground planes with an efficient 2-D FDTD/lumped element method | T.-K. Wang; S.-T. Chen; C.-W. Tsai; S.-M. Wu; J. J. Drewniak; T.-L. Wu; TZONG-LIN WU | IEEE Transactions on Advanced Packaging | 30 | 22 | |
2019 | Modeling of radiated emission caused by coaxial-to-microstrip transition | Li, P.-J.; Chou, C.-C.; Wu, T.-L.; TZONG-LIN WU | Proceedings of the 2019 21st International Conference on Electromagnetics in Advanced Applications, ICEAA 2019 | 1 | 0 | |
2018 | Modularized prototype of 5G mmWave base station system at 38 GHz | L. H. Yen; TZONG-LIN WU ; Ssu-Hao Su; Che-Yao Fan; Fang-Hsien Chu; Fang-Yao Kuo; Hsin-Chia Lu; Shau-Gang Mao; Kun-You Lin; Tsung-Chieh Yen; Tzong-Lin Wu; HSIN-CHIA LU | IEEE International Symposium on Electromagnetic Compatibility and 2018 IEEE Asia-Pacific Symposium on Electromagnetic Compatibility (EMC/APEMC) | 2 | 0 | |