公開日期 | 標題 | 作者 | 來源出版物 | scopus | WOS | 全文 |
2020 | Solution strengthening the Ti-6Al-4V joints were brazed by Ti-15Cu-15Ni and Ag-26.7Cu-4.5Ti filler foils | Lee, K.-H.; Yang, S.-Y.; SEN-YEU YANG | Materials Science Forum | | | |
- | Specific-light-cured and pressure-differential embossing apparatus
特定光固化型壓差式壓印成型設備 | 楊申語 | | | | |
2008 | A Study of an innovative technology for manufacturing optical waveguides based on vacuum-assisted micromolding | Weng, Y.-J.; Weng, Y.-C.; Yang, S.-Y.; Huang, J.-C.; Fang, H.-S.; Wong, Y.-C.; SEN-YEU YANG | Polymer - Plastics Technology and Engineering | | | |
1996 | A study of rib geometry for gas-assisted injection molding | Yang, S.Y.; Huang, F.Z.; Liau, W.N.; SEN-YEU YANG | Polymer Engineering and Science | | | |
2009 | Study of transfer stamping technique for fabricating microstructure | Jian-Wei Chen; Jing-Tang Wu; Sen-Seu Yang; SEN-YEU YANG | The 35th International Conference on Macro and Nano Engineering(MNE), 28 September – 1 October 2009, Ghent, Belgium | | | |
1997 | Study on accuracy of angled advanced composite tools | Huang, C.K.; Yang, S.Y.; SEN-YEU YANG | Materials and Manufacturing Processes | | | |
2010 | A study on application of making porous micro-structural aluminum oxide template by anodic aluminum oxide processing technology in cell reproduction | Weng, Y.J.; Huang, J.C.; Weng, Y.C.; Wong, Y.C.; Liu, H.K.; Yang, S.Y.; SEN-YEU YANG | Key Engineering Materials | | | |
2008 | Study on flow imbalance during filling a multi-cavity mold using a H-type runners | Yang, Sen-Yeu ; Huang, Tzu-Chien; Huang, Po-Hsun; Ko, Tai-Yu | Key Engineering Materials | 0 | 0 | |
2004 | Study on numerical simulation and experiment of lightguide plate in injection molding | Shen, Y.K.; Wu, W.Y.; Yang, S.Y.; Jian, H.M.; SEN-YEU YANG | Journal of Reinforced Plastics and Composites | 16 | 13 | |
2012 | A study on the application of electromagnetic-field-assisted magnetic soft mold photocuring imprinting technology in micro-structure gradient replication molding | Weng, Yung-Chun; Weng, Yung-Jin; Yang, Sen-Yeu | Microelectronic Engineering | 4 | 3 | |
2008 | A Study on the Application of Innovative Magnetically Assisted Flexible Magnetic Mold in Large-Area Curved Surface Microstructure Impressing Process Technology | Y.-J. Weng; SEN-YEU YANG | The 42nd IUPAC World Polymer Congress (MACRO2008), June 29 -July 4 ,2008, Taipei, Taiwan. | | | |
2007 | A study on the innovative microlens projection lithography applied to the production of microstructures | Weng, Y.-J.; Yang, S.-Y.; MING-SHIANG WU ; Weng, Y.-C.; SEN-YEU YANG ; LON A. WANG | Polymers for Advanced Technologies | 10 | 9 | |
2011 | A study on the micro-injection molding of multi-cavity ultra-thin parts | Yang, S.-Y.; Nian, S.-C.; Huang, S.-T.; Weng, Y.-J.; YangSY | Polymers for Advanced Technologies | 0 | 0 | |
1995 | Study on the Performance of Cooling Systems in Precision Injection Molds | Yang, Sy; Chang, Hc; SEN-YEU YANG | International Polymer Processing | | 1 | |
2003 | Study on the Performance of Rapid Mold Heating/Cooling System for Micro Injection Molding | 楊申語; SEN-YEU YANG | Proceeding of 19th Annual Meeting of Polymer Processing Society | | | |
2002 | Study on the Residual Wall Thickness at Dimensional Transitions and Curved Sections in Gas-Assisted Injection Molded Circular Tubes | Yang, S. Y.; Chou, H. L.; YangSY | Polymer Engineering and Science | | | |
2002 | Study on the residual wall thickness at dimensional transitions and curved sections in gas-assisted molded circular tubes | Yang, S.Y.; Chou, H.L.; SEN-YEU YANG | Polymer Engineering and Science | | | |
2014 | Substrate effect on characteristics of PbZr<inf>x</inf>Ti <inf>1-x</inf>O<inf>3</inf> (PZT) film | Cheng, C.-C.; Young, S.-L.; Chen, H.-Z.; Yang, S.-Y.; SEN-YEU YANG | Integrated Ferroelectrics | | | |
2009 | Thin film patterns directly fabricated using transfer stamping technique | Chan, Bin-Da; Hsieh, Kuo-Huang ; Yang, Sen-Yeu | Journal of Micromechanics and Microengineering | | | |
2009 | Thin-film patterns directly fabricated using a transfer stamping technique | Chan, B.-D.; Hsieh, K.-H.; Yang, S.-Y.; SEN-YEU YANG | Journal of Micromechanics and Microengineering | | | |