公開日期 | 標題 | 作者 | 來源出版物 | scopus | WOS | 全文 |
2010 | Rapid fabrication of surface-relief plastic diffusers by ultrasonic embossing | Liu, Shih-Jung; Huang, Yu-Chin; Yang, Sen-Yeu ; Hsieh, Kuo-Huang | Optics & Laser Technology | 22 | 20 | |
2007 | Rapid fabrication of ultraviolet-cured polymer microlens arrays by soft roller stamping process | Chang, C.-Y.; Yang, S.-Y.; Chu, M.-H.; SEN-YEU YANG | Microelectronic Engineering | | | |
2007 | Rapid fabrication of ultraviolet-cured polymer microlens arrays by soft roller stamping process | Chang, Chih-Yuan; Yang, Sen-Yeu ; Chu, Ming-Hui | Microelectronic Engineering | | | |
2013 | Real-time diagnosis of gas-assisted hot embossing process by ultrasound | Cheng, C.-C.; Wu, C.-L.; Wu, K.-T.; Yang, S.-Y.; SEN-YEU YANG | Polymer Engineering and Science | | | |
2024 | Replication of large-area microstructures by combining movable induction heating and roller hot embossing | Hung, Wei Cheng; Chiu, Chun Yang; He, Jyun Wei; Ke, Kun Cheng; SEN-YEU YANG | Polymer Engineering and Science | | | |
2008 | Replication of microlens arrays by gas-assisted hot embossing | Hocheng, H.; Wen, T.-T.; Yang, S.-Y.; SEN-YEU YANG | Materials and Manufacturing Processes | | | |
2000 | Ribbed Package Geometry for Reducing Thermal Warpage and Wire Sweep during PBGA Encapsulation | Yang, S. Y.; Jiang, S. C.; Lu, W. S.; YangSY | IEEE Transactions on Components and Packaging Technologies | | | |
2006 | A roller embossing process for rapid fabrication of microlens arrays on glass substrates | Weng, Yung Chun; Yang, Sen Yeu | Microsystem Technologies - Micro- and Nanosystems. Information Storage and Processing Systems | 105 | | |
2024 | Rolling V-groove microstructures on glass using a modified PDMS mold | Hsu, Ming Huai; YAO-YANG TSAI ; Gao, Jhao Hong; SEN-YEU YANG | Microsystem Technologies | | | |
2003 | Secondary Gas Penetrations in Ribs During Full-Shot Gas-Assisted Injection Molding | Yang, S. Y.; Lin, C. T.; Chang, J. H.; YangSY | Advances in Polymer Technology | 26 | | |
2006 | Singular uniformity after reflow of varied-shaped flip chip solder bump on single substrate | Hsu, H.-J.; Huang, J.-T.; Chao, P.-S.; Wu, C.-S.; Shih, S.-H.; Yang, S.-Y.; SEN-YEU YANG | 2006 International Conference on Electronic Materials and Packaging | | | |
2006 | Soft mold and gasbag pressure mechanism for patterning submicron patterns onto a large concave substrate | Cheng, Fang-Sung; SEN-YEU YANG ; Nian, Shih-Chih; LON A. WANG | Journal of Vacuum Science and Technology B: Microelectronics and Nanometer Structures | 19 | 21 | |
2020 | Solution strengthening the Ti-6Al-4V joints were brazed by Ti-15Cu-15Ni and Ag-26.7Cu-4.5Ti filler foils | Lee, K.-H.; Yang, S.-Y.; SEN-YEU YANG | Materials Science Forum | | | |
- | Specific-light-cured and pressure-differential embossing apparatus
特定光固化型壓差式壓印成型設備 | 楊申語 | | | | |
2008 | A Study of an innovative technology for manufacturing optical waveguides based on vacuum-assisted micromolding | Weng, Y.-J.; Weng, Y.-C.; Yang, S.-Y.; Huang, J.-C.; Fang, H.-S.; Wong, Y.-C.; SEN-YEU YANG | Polymer - Plastics Technology and Engineering | | | |
1996 | A study of rib geometry for gas-assisted injection molding | Yang, S.Y.; Huang, F.Z.; Liau, W.N.; SEN-YEU YANG | Polymer Engineering and Science | | | |
2009 | Study of transfer stamping technique for fabricating microstructure | Jian-Wei Chen; Jing-Tang Wu; Sen-Seu Yang; SEN-YEU YANG | The 35th International Conference on Macro and Nano Engineering(MNE), 28 September – 1 October 2009, Ghent, Belgium | | | |
1997 | Study on accuracy of angled advanced composite tools | Huang, C.K.; Yang, S.Y.; SEN-YEU YANG | Materials and Manufacturing Processes | | | |
2010 | A study on application of making porous micro-structural aluminum oxide template by anodic aluminum oxide processing technology in cell reproduction | Weng, Y.J.; Huang, J.C.; Weng, Y.C.; Wong, Y.C.; Liu, H.K.; Yang, S.Y.; SEN-YEU YANG | Key Engineering Materials | | | |
2008 | Study on flow imbalance during filling a multi-cavity mold using a H-type runners | Yang, Sen-Yeu ; Huang, Tzu-Chien; Huang, Po-Hsun; Ko, Tai-Yu | Key Engineering Materials | 0 | 0 | |