公開日期 | 標題 | 作者 | 來源出版物 | scopus | WOS | 全文 |
2015 | A TEG-based Self-Powered Warmer for the Exhausted Cryogenic Nitrogen | Mei-Jiau Huang | 34th Annual International Conference on Thermoelectrics & 13th European Conference on Thermoelectrics | | | |
2021 | A TEG-based waste heat recovery system for atmospheric pressure plasma jets: Model prediction and experimental verification | MEI-JIAU HUANG ; Lin Y.-H; Hsu P.-C; JIA-YANG JUANG | Applied Thermal Engineering | 5 | 4 | |
2019 | The temperature distribution due to the ballistic-diffusive phonon transport | Huang, M.-J.; Huang, H.-B.; MEI-JIAU HUANG | International Journal of Heat and Mass Transfer | | | |
2009 | The temperature-quantum-correction effect on the MD-calculated thermal conductivity of silicon thin films | Chang T.-M.; Weng C.-C.; Huang M.-J. ; Liu C.-K.; Yu C.-K. | Computer Modeling in Engineering Sciences | 0 | | |
2008 | A theoretical study of the specific heat and Debye temperature of low-dimensional materials | Huang M.-J. ; Chang T.-M.; Liu C.-K.; Yu C.-K. | International Journal of Heat and Mass Transfer | 15 | 14 | |
2006 | Thermal and thermal stress analysis of a thin-film thermoelectric cooler under the influence of the Thomson effect | Huang M.-J. ; Chou P.-K.; Lin M.-C. | Sensors | 37 | 34 | |
2005 | Thermal and thermal stress analysis of a thin-film thermoelectric cooler under the influence of the Thomson effect | Huang M.-J. ; Chou P.-K.; Lin M.-C. | International Conference on Thermoelectrics | 0 | 0 | |
2008 | Thermal conductivity measurement and interface thermal resistance estimation using SiO2 thin film | Chien, Heng-Chieh; Yao, Da-Jeng; MEI-JIAU HUANG ; Chang, Tien-Yao | Review of Scientific Instruments | 72 | 64 | |
2010 | Thermal conductivity modeling of micro- and nanoporous silicon | Liu L.-C.; Huang M.-J. | International Journal of Thermal Sciences | 34 | 30 | |
2008 | Thermal conductivity of Si/SiGe superlatice film | Liu, Chun-Kai; Yu, Chih-Kuang; Chien, Heng-Chieh; Hsu, Chung-Yen; Dai, Ming-Ji; Luo, Guang-Li; Huang, Mei-Jiau | Journal of Applied Physics | | | |
2008 | Thermal conductivity of Si/SiGe superlattice film | Liu C.-K.; Chien H.-C.; Dai M.-J.; Yu C.-K.; Hsu C.-Y.; Huang M.-J. ; Luo G.-L. | ASME Micro/Nanoscale Heat Transfer International Conference | 0 | 0 | |
2008 | Thermal conductivity of Si/SiGe superlattice films | Liu C.-K.; Yu C.-K.; Chien H.-C.; Kuo S.-L.; Hsu C.-Y.; Dai M.-J.; Luo G.-L.; Huang S.-C.; Huang M.-J. | Journal of Applied Physics | 47 | 46 | |
2020 | Thermal performance analysis of a package using non-simulation technique | Chien, H.-C.; Huang, M.-J.; Chen, Z.-Z.; MEI-JIAU HUANG | 2020 International Symposium on VLSI Technology, Systems and Applications, VLSI-TSA 2020 | | | |
2019 | Thermal spreading resistance of heat sources on rectangular flux channel under non-uniform convective cooling | Huang, M.-J.; Shaw, Y.-R.; Chien, H.-C.; MEI-JIAU HUANG | International Journal of Thermal Sciences | | | |
2012 | Thermal transport within quantum-dot nanostructured semiconductors | Huang M.-J. ; Chang T.-M. | International Journal of Heat and Mass Transfer | 6 | 5 | |
2010 | The thickness difference method for measuring the thermal conductivity of thick films | Huang M.-J. ; Chang T.-Y.; Chien H.-C.; Sun W.-C.; Yao D.-J. | Journal of Microelectromechanical Systems | 0 | 0 | |
2017 | Tool condition monitoring with current signals for a low-power spindle | Wang C.; Huang M. ; Chung T.T.; Young H.T.; KUAN-MING LI ; HONG-TSU YOUNG | 2017 IEEE International Conference on Applied System Innovation: Applied System Innovation for Modern Technology | 7 | 0 | |
2023 | The Tortuosity Effect on the Thermal Conductivity of Si Nanowires | Hong, Hao Jhan; MEI-JIAU HUANG | Nanoscale and Microscale Thermophysical Engineering | 0 | 0 | |
1995 | Velocity autocorrelations of decaying isotropic homogeneous turbulence | Huang, M.-J.; Leonard, A.; MEI-JIAU HUANG | Physics of Fluids | | | |
2013 | A vortex method suitable for long time simulations of flow over body of arbitrary geometry | Huang C.-J.; Huang M.-J. | Computers and Fluids | 4 | 3 | |