Issue Date | Title | Author(s) | Source | scopus | WOS | Fulltext/Archive link |
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2013 | The demonstration of nonlinear analytic model for the strain field induced by thermal copper filled TSVs (through silicon via) | Liao, M.-H. ; Chen, C.-H.; Lee, J.J.; Chen, K.C.; JYH-JONE LEE | 2013 e-Manufacturing and Design Collaboration Symposium | 0 | 0 | |
2009 | The dependence of the performance of strained NMOSFETs on channel width | Yeh, L.; Liao, M.H. ; Chen, C.H.; Wu, J.; Lee, J.Y.-M.; Liu, C.W.; Lee, T.L.; CHEE-WEE LIU | IEEE Transactions on Electron Devices | 4 | 4 | |
2006 | The process and optoelectronic characterization of Ge-on-insulator | Lin, C.-H.; Yu, C.-Y.; Liao, M.H. ; Huang, C.-F.; Lee, C.-J.; Lee, C.-Y.; CHEE-WEE LIU | ECS Transactions | 1 | 0 | |
2018 | Thickness dependence of electrical conductivity and thermo-electric power of Bi2.0Te2.7Se0.3/Bi0.4Te3.0Sb1.6 thermo-electric devices | M. H.Liao ; K.-C. Huang; F.-A. Tsai; C.-Y. Liu; C. Lien; M.-H. Lee | AIP Advances | |||
2018 | Thickness dependence of electrical conductivity and thermo-electric power of Bi<inf>2.0</inf>Te<inf>2.7</inf>Se<inf>0.3</inf>/Bi<inf>0.4</inf>Te<inf>3.0</inf>Sb<inf>1.6</inf> thermo-electric devices | Liao, M.-H.; Huang, K.-C.; Tsai, F.-A.; Liu, C.-Y.; Lien, C.; Lee, M.-H.; MING-HAN LIAO | AIP Advances | |||
2023 | Two-Dimensionally Arranged Display Drivers Achieved by OS/Si Structure | Komura, Yusuke; Miyata, Shoki; Okamoto, Yuki; Tamatsukuri, Yuki; Inoue, Hiroki; Saito, Toshihiko; Kozuma, Munehiro; Kobayashi, Hidetomo; Onuki, Tatsuya; Yanagisawa, Yuichi; Takeuchi, Toshihiko; Okazaki, Yutaka; Kunitake, Hitoshi; Nakamura, Daiki; Nagata, Takaaki; Yamane, Yasumasa; Ikeda, Makoto; Yen, Shih Ci; Chang, Chuan Hua; Hsieh, Wen Hsiang; Yoshida, Hiroshi; Chen, Min Cheng; MING-HAN LIAO ; Chang, Shou Zen; Yamazaki, Shunpei | Digest of Technical Papers - Symposium on VLSI Technology | 0 | 0 | |
2015 | 利用拉曼光譜檢測半導體缺陷技術 | 廖洺漢 ; 陳畤華; 謝卓帆 |