公開日期 | 標題 | 作者 | 來源出版物 | scopus | WOS | 全文 |
1991 | Fabrication, Microstructure and Properties of SiC-AlN Ceramic Alloys | 韋文誠 ; Lee, R. R.; Wei, Wen-Cheng | Ceramic Engineering Science Proceedings | | | |
1994 | Fine SiC inclusions and grain boundary phases in pressureless sintered SiAlON | Wei, W.-C.J.; Halloran, J.W.; WEN-CHENG J. WEI | Journal of the European Ceramic Society | | | |
2015 | Finite element analysis and design of thermal-mechanical stresses in multilayer ceramic capacitors | Huang C.-W.; Chen B.-T.; Chen K.-Y.; Hsueh C.-H.; Wei W.-C.; CHUN-HWAY HSUEH ; WEN-CHENG J. WEI | International Journal of Applied Ceramic Technology | 18 | 16 | |
1993 | Flextural strength and surface grinding properties of alumina | 韋文誠 ; Chyr, B. C.; 顧鈞豪; Wei, Wen-Cheng ; Koo, Chun-Hao | Chinese Journal of Materials Science | | | |
2004 | Formation of intergranular amorphous films during the microstructural development of liquid phase sintered silicon carbide ceramics | Volz, E.; Roosen, A.; Wang, S.-C.; WEN-CHENG J. WEI | Journal of Materials Science | 14 | 13 | |
2001 | Formation of mullite thin film via a sol-gel process with polyvinylpyrrolidone additive | Chen, Yen-Yu; Wei, Wen-Cheng J. | Journal of the European Ceramic Society | 41 | | |
1992 | Fracture Toughness Testing of Ceramic Materials | 韋文誠 ; SHIN CS ; Hsu, P. H.; Wei, Wen-Cheng | Conference of Fracture Mechanics | | | |
2016 | Glass and hot extrusion by ME module for 3D additive manufacturing | Wang P.W.; Chou C.S.; Wei W.C.J.; Liu B.H.; Liu A.; Wang A.B.; AN-BANG WANG ; WEN-CHENG J. WEI | Proceedings of the IEEE International Conference on Industrial Technology | 2 | 0 | |
1989 | Grain Boundary Phase in Pressureless Sintered SiA1ON | 韋文誠 ; Halloran. J. W.; Wei, Wen-Cheng | American Ceramic Society 91st Annual Meeting | | | |
2008 | Grain boundary pinning of polycrystalline Al2O3 by Mo inclusions | Lin, Ching-Jang; Wei, Wen-Cheng J. | Materials Chemistry and Physics | | | |
2008 | Grain boundary pinning of polycrystalline Al<inf>2</inf>O<inf>3</inf> by Mo inclusions | Lin, C.-J.; Wei, W.-C.J.; WEN-CHENG J. WEI | Materials Chemistry and Physics | | | |
1992 | Grain Delamination of Ag-Doped YBa <inf>2</inf> Cu <inf>3</inf> O <inf>7-x</inf> Superconductor | Wei, W.-C.; Lee, W.-H.; WEN-CHENG J. WEI | Japanese Journal of Applied Physics | | | |
1992 | Grain delamination of Ag-Doped YBa2Cu3O7-X supercondeuctor Japanses Journal of Applied Physics | 韋文誠 ; Lee, W. H.; Wei, Wen-Cheng | Japanese Journal of Applied Physics. Part 1 | | | |
2008 | Growth of Tabular alpha-Al2O3 Grains on Porous Alumina Substrate | 韋文誠 | Journal of the American Ceramic Society | | | |
2008 | Growth of tabular α-Al<inf>2</inf>O<inf>3</inf> grains on porous alumina substrate | Yu, B.-Y.; Wei, W.-C.J.; WEN-CHENG J. WEI | Journal of the American Ceramic Society | | | |
1996 | Hardness and adhesive properties of (Cr, Mo) oxycarbide films on stainless steel via vapor deposition | Lo, M. H.; MIN-HUI LO ; WEN-CHENG J. WEI | Journal of Materials Research | 5 | 4 | |
2019 | High temperature electrical properties and oxidation resistance of V-Nb-Mo-Ta-W high entropy alloy thin films | Chen Y.-Y; Hung S.-B; Wang C.-J; WEN-CHENG J. WEI ; Lee J.-W. | Surface and Coatings Technology | 40 | 34 | |
2018 | Improved contact lens injection molding production by 3D printed conformal cooling channels | Lin Y.F.; Wu J.R.; Liu B.H.; Wei W.C.J.; Wang A.B.; AN-BANG WANG ; WEN-CHENG J. WEI ; REN-CHYUAN LUO | SII 2017 - 2017 IEEE/SICE International Symposium on System Integration | 6 | 0 | |
1991 | Interfacial Stress Analysis of Single Layer Coated Ceramic Composite | Wei, Wen-Cheng | 1991 Annual Conference of the Chinese Society for Materials Science | | | |
2006 | Investigation of chromium carbide/alumina nano-composite prepared via MOCVD in fluidized bed and densification process | Lin, Hao-Tung; Huang, Wei-Sheng; Wang, Sheng-Chang; Lu, Horng-Hwa; Wei, Wen-Cheng J. ; Huang, Jow-Lay | Materials Science and Engineering: B | 5 | | |