公開日期 | 標題 | 作者 | 來源出版物 | scopus | WOS | 全文 |
1992 | Equivalent circuit of a through via in multi-layer environment | Chang, K.K.; Kuo, C.-N.; Wu, T.-L.; Chen, W.-L.; Wu, R.-B.; TZONG-LIN WU | Electrical Performance of Electronic Packaging, EPEP 1992 | | | |
2021 | Erratum: A fully integrated arbitrary power divider on printed circuit board by a novel SMD-resistor-free isolation network (IEEE Transactions on Components, Packaging and Manufacturing Technology (2020) 10:11 (1889-1901) DOI: 10.1109/TCPMT.2020.3029782) | Chen S; TZONG-LIN WU | IEEE Transactions on Components, Packaging and Manufacturing Technology | | | |
2015 | Estimation Method for Statistical Eye Diagram in a Nonlinear Digital Channel | C.-C. Chou; S.-Y. Hsu; TZONG-LIN WU | IEEE Transactions on Electromagnetic Compatibility | | | |
2011 | Evaluation of magnetic field from varied permutation power transmission line at high technology nano-fab | Y.-L. Song; C. Yu; F.-C. Chuang; Y.-C. Tseng; J.-Y. Zou; S.-K. Hsu; T.-G. Ma; T.-L. Wu; L.-M. Chang; TZONG-LIN WU | Int. Conf. Power Electron. Systems Applications | | | |
2021 | Extraction of Complex Permittivity of Dielectrics on Package from W-band to D-band | Lin Y.-T; Kuo H.-C; Wu P.-I; Jhong M.-F; Pan P.-C; Liu C.-Y; Wang C.-C; TZONG-LIN WU | Proceedings - Electronic Components and Technology Conference | 4 | 0 | |
2021 | Extremely Low-Loss Planar Transition from Hollow Dielectric Waveguide to Printed Circuit Board for Millimeter-Wave Interconnect | Liu C.-Y; Ding H.-E; Wu S.-H; TZONG-LIN WU | IEEE Transactions on Microwave Theory and Techniques | | | |
2021 | Eye Comparison between Unencoded and 128b/130b-encoded NRZ Signals | Weng P.-Y; Chen C.-H; Chen J; Kuo E; Lin E; Chu P; Liao C.-L; Mutnury B; TZONG-LIN WU | EPEPS 2021 - IEEE 30th Conference on Electrical Performance of Electronic Packaging and Systems | 0 | 0 | |
2018 | An eye diagram improvement method using simulation annealing algorithm | P. J. Li; T. L. Wu; TZONG-LIN WU | IEEE 22nd Workshop on Signal and Power Integrity (SPI) | 2 | 0 | |
2012 | Eye prediction of digital driver with power distribution network noise | C.-C. Chou; H.-H. Chuang; S.-H. Weng; C.-K. Cheng; TZONG-LIN WU | IEEE Elect. Performance Electronics Package Systems | | | |
1997 | Fabrication and electromagnetic modeling of fiber-optic coupling devices based on weakly fused tapered structure | H.-C. Chang; C.-W. Wu; T.-L. Wu; S.-W. Yang; G.-J. Liao; TZONG-LIN WU | Taiwan Optoelectron. Ind. Technol. Develop. Conf. | | | |
2018 | Factors affecting near-end crosstalk (NEXT) in high speed serial links | Weng, P.-Y.; Chen, C.-H.; Chen, C.-H.; Liao, C.-L.; Wu, T.-L.; Mutnury, B.; TZONG-LIN WU | 15th International Conference on Electromagnetic Interference and Compatibility, INCEMIC 2018 | | | |
2018 | Fast and accurate yield rate prediction of PCB embedded common-mode filter with artificial neural network | Y. T. Lin; C. H. Cheng; T. L. Wu; TZONG-LIN WU | IEEE International Symposium on Electromagnetic Compatibility and 2018 IEEE Asia-Pacific Symposium on Electromagnetic Compatibility (EMC/APEMC) | 5 | 0 | |
2014 | Fast prediction of radiation from high-speed/high-density connectors | H.-C. Chen; T.-L. Wu; S. Connor; B. Archambeault; TZONG-LIN WU | IEEE. Int. Symp. Electromagn. Compat. | | | |
0 | Filtering device and differential signal transmission circuit capable of suppressing common-mode noises upon transmission of a differential signal | TZONG-LIN WU ; Chung-Hao Tsai | | | | |
1995 | Form birefringence of biconical-taper fiber-optic couplers under weakly fused condition | TZONG-LIN WU ; H.-C. Chang | Topical Meeting Integr. Photon. Research | | | |
2020 | A Fully Integrated Arbitrary Power Divider on Printed Circuit Board by a Novel SMD-Resistor-Free Isolation Network | Chen, S.; TZONG-LIN WU | IEEE Transactions on Components, Packaging and Manufacturing Technology | | | |
2008 | Fundamentals of signal integrity | TZONG-LIN WU | IEEE International Symposium on Electromagnetic Compatibility | | | |
2018 | HBM3 PPA Performance Evaluation by TSV Model with Micro-Bump and Hybrid Bonding | Huang, Li Hsin; Cheng, Yu Ying; TZONG-LIN WU | EPEPS 2023 - IEEE 32nd Conference on Electrical Performance of Electronic Packaging and Systems | | | |
2005 | High electromagnetic immunity power/ground planes using L-bridged electromagnetic bandgap (EBG) structure | H.-C. Kuo; S.-T. Chen; C.-C. Wang; S.-W. Wen; H.-C. Li; C.-C. Chien; TZONG-LIN WU | Asia-Pacific Symp. Electromagn. Compat. | | | |
2005 | High electromagnetic shielding of plastic package for 2.5Gbps optical transceiver modules | TZONG-LIN WU ; C.-W. Lin; W.-C. Hung; C.-H. Lee; W.-S. Jou; W.-H. Cheng | IEEE Transactions on Advanced Packaging | | | |