公開日期 | 標題 | 作者 | 來源出版物 | scopus | WOS | 全文 |
---|---|---|---|---|---|---|
2015 | Thermal-Aware 3D Network-On-Chip (3D NoC) Designs: Routing Algorithms and Thermal Managementse | Kun-Chih (Jimmy) Chen; Chih-Hao Chao; An-Yeu (Andy) Wu; AN-YEU(ANDY) WU | IEEE Circuits and Systems Magazine | 40 | 30 | |
2017 | Thermal/Traffic Mutual-Coupling Co-simulation Platform for 3D Network-on-Chip (NoC) Designs | An-Yeu (Andy) Wu; Kun-Chih (Jimmy) Chen; Chih-Hao Chao; AN-YEU(ANDY) WU ; 吳安宇 | International Workshop on Network on Chip Architectures (NoCArc'17) | 0 | 0 | |
2017 | Variation-Aware Reliable Many-Core System Design by Exploiting Inherent Core Redundancy | Huai-Ting Li; Ching-Yao Chou; Yuan-Ting Hsieh; Wei-Ching Chu; An-Yeu (Andy) Wu; AN-YEU(ANDY) WU ; 吳安宇 | IEEE Trans. Very Large Scale Integration (VLSI) Systems (TVLSI) | 8 | 8 |