公開日期 | 標題 | 作者 | 來源出版物 | scopus | WOS | 全文 |
---|---|---|---|---|---|---|
2005 | Electromagnetic bandgap power/ground planes for wideband suppression of ground bounce noise and radiated emission in high-speed circuits | TZONG-LIN WU ; Y.-H. Lin; T.-K. Wang; C.-C. Wang; S.-T. Chen | IEEE Transactions on Microwave Theory and Techniques | 187 | ||
2008 | Fewest vias design for microstrip guard trace by using overlying dielectric | Y.-S. Cheng; W.-D. Guo; G.-H.Shiue; H.-H. Cheng; C.-C. Wang; RUEY-BEEI WU | IEEE 17th Topical Meeting on Electrical Performance of Electronic Packaging | |||
2005 | High electromagnetic immunity power/ground planes using L-bridged electromagnetic bandgap (EBG) structure | H.-C. Kuo; S.-T. Chen; C.-C. Wang; S.-W. Wen; H.-C. Li; C.-C. Chien; TZONG-LIN WU | Asia-Pacific Symp. Electromagn. Compat. | |||
2011 | Mold-based compartment shielding to mitigate the intra-system coupled noise on SiP modules | C.-Y. Hsiao; C.-H. Huang; C.-D. Wang; K.-H. Liao; C.-H. Shen; C.-C. Wang; TZONG-LIN WU | IEEE. Int. Symp. Electromagn. Compat. | |||
2008 | Placement of shorting vias for power integrity in multi-layered structures | S.-H. Hsu; Y.-S. Cheng; W.-D. Guo; H.-H. Cheng; C.-C. Wang; RUEY-BEEI WU | IEEE 17th Topical Meeting on Electrical Performance of Electronic Packaging | |||
2018 | Transparent flexible a-IGZO thin-film transistors | C.-C. Wu; C.-C. Wang; S.-M. Hsu; D.-Y. Su; F.-Y. Tsai; I-C. Cheng; I-CHUN CHENG | Optics & Photonics Taiwan, International Conference |