公開日期 | 標題 | 作者 | 來源出版物 | scopus | WOS | 全文 |
---|---|---|---|---|---|---|
2008 | Placement of shorting vias for power integrity in multi-layered structures | S.-H. Hsu; Y.-S. Cheng; W.-D. Guo; H.-H. Cheng; C.-C. Wang; RUEY-BEEI WU | IEEE 17th Topical Meeting on Electrical Performance of Electronic Packaging | |||
2018 | Transparent flexible a-IGZO thin-film transistors | C.-C. Wu; C.-C. Wang; S.-M. Hsu; D.-Y. Su; F.-Y. Tsai; I-C. Cheng; I-CHUN CHENG | Optics & Photonics Taiwan, International Conference |