公開日期 | 標題 | 作者 | 來源出版物 | scopus | WOS | 全文 |
---|---|---|---|---|---|---|
2005 | Controlling the microstructure from the gold-tin Reaction | Tsai, J. Y.; Chang, C. W.; Shieh, Y. C.; Hu, Y. C.; Kao, and C. R. | Journal of Electronic Materials | |||
2004 | Cross-interaction of UBM and soldering pad in flip-chip solder joints | Tsai, C. M.; Luo, W. C.; Chang, C. W.; Shieh, Y. C.; Kao, and C. R. | Journal of Electronic Materials |