公開日期 | 標題 | 作者 | 來源出版物 | scopus | WOS | 全文 |
2010 | The compatibility analysis of thread migration and DVFS in multi-core processor | Oh, D.; Chen, C.C.P.; Kim, N.; Hu, Y.H.; CHUNG-PING CHEN | Proceedings of the 11th International Symposium on Quality Electronic Design, ISQED 2010 | | | |
2012 | Efficient thermal simulation for 3-D IC with thermal through-silicon vias | Oh, D.; Chen, C.C.P.; Hu, Y.H.; CHUNG-PING CHEN | IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems | | | |
2011 | A mathematical method for VLSI thermal simulation at the system and circuit levels | Oh, D.; Chen, C.C.P.; Hu, Y.H.; CHUNG-PING CHEN | Recent Topics on Modeling of Semiconductor Processes, Devices, and Circuits | | | |
2010 | Runtime temperature-based power estimation for optimizing throughput of thermal-constrained multi-core processors | Oh, D.; Kim, N.S.; Chen, C.C.P.; Davoodi, A.; Hu, Y.H.; CHUNG-PING CHEN | Proceedings of the Asia and South Pacific Design Automation Conference, ASP-DAC | | | |