Issue Date | Title | Author(s) | Source | scopus | WOS | Fulltext/Archive link |
---|---|---|---|---|---|---|
2020 | Unified Redistribution Layer Routing for 2.5D IC Packages | Chiang, C.-H.; Chuang, F.-Y.; YAO-WEN CHANG | Proceedings of the Asia and South Pacific Design Automation Conference, ASP-DAC | 2 | 0 |