公開日期 | 標題 | 作者 | 來源出版物 | scopus | WOS | 全文 |
2012 | Hybrid thermal solution for 3D-ICs: Using thermal TSVs with placement algorithm for stress relieving structures | Chien, J.-H.; Yu, H.; Tsai, N.-Y.; Lung, C.-L.; Hsu, C.-C.; Chou, Y.-F.; Chen, P.-H.; Chang, S.-C.; PING-HEI CHEN | Electronic Components and Technology Conference | 0 | 0 | |
2011 | Realization of virtual 126-core system with thermal sensor-network using metallic thermal skeletons | Chien, J.-H.; Lung, C.-L.; Tsai, K.-J.; Hsu, C.-C.; Chen, T.-S.; Chou, Y.-F.; Chen, P.-H.; Chang, S.-C.; PING-HEI CHEN | Electronic Components and Technology Conference | 0 | 0 | |
2012 | Thermal stress aware design for stacking IC with through glass via | Chien, J.-H.; Yu, H.; Lung, C.-L.; Chang, H.-C.; Tsai, N.-Y.; Chou, Y.-F.; Chen, P.-H.; Chang, S.-C.; Kwai, D.-M.; PING-HEI CHEN | International Microsystems, Packaging, Assembly, and Circuits Technology Conference | | | |