公開日期 | 標題 | 作者 | 來源出版物 | scopus | WOS | 全文 |
2020 | Eco-Friendly Polyfluorene/Poly(butylene succinate) Blends and Their Electronic Device Application on Biodegradable Substrates | Hsieh, H.-C.; Wu, N.; Chuang, T.-H.; Lee, W.-Y.; Chen, J.-Y.; WEN-CHANG CHEN | ACS Applied Polymer Materials | | | |
2009 | Effect of adding Ge on rapid whisker growth of Sn-3Ag-0.5Cu-0.5Ce alloy | Chuang, T.-H.; Chi, C.-C.; TUNG-HAN CHUANG | Journal of Alloys and Compounds | | | |
2019 | Effect of alloying Au on the microstructural, mechanical and electrical properties of Ag-based alloy wires | Kuo, B.-H.; Tsai, D.-C.; Huang, Y.-L.; Hsu, P.-C.; Chuang, T.-H.; Lee, J.-D.; Tsai, H.-H.; Shieu, F.-S.; TUNG-HAN CHUANG | Journal of Materials Science: Materials in Electronics | | | |
2013 | Effect of annealing twins on electromigration in Ag-8Au-3Pd bonding wires | Chuang, T.-H.; Wang, H.-C.; Chuang, C.-H.; Lee, J.-D.; Tsai, H.-H.; TUNG-HAN CHUANG | Journal of Electronic Materials | | | |
2018 | Effect of Au Addition on the Microstructure and Properties of Ag-4Pd Bonding Wires | Kuo, B.-H.; Tsai, D.-C.; Huang, Y.-L.; Hsu, P.-C.; Chuang, T.-H.; Tsai, H.-H.; Shieu, F.-S.; TUNG-HAN CHUANG | Metallurgical and Materials Transactions A: Physical Metallurgy and Materials Science | | | |
2012 | Effects of annealing twins on the grain growth and mechanical properties of Ag-8Au-3Pd bonding wires | Chuang, T.-H.; Tsai, C.-H.; Wang, H.-C.; Chang, C.-C.; Chuang, C.-H.; Lee, J.-D.; Tsai, H.-H.; TUNG-HAN CHUANG | Journal of Electronic Materials | | | |
2019 | Electrical and magnetic properties of (Al, Co) co-doped ZnO films deposited by RF magnetron sputtering | Sun, H.; Chen, S.-C.; Wang, C.-H.; Lin, Y.-W.; Wen, C.-K.; Chuang, T.-H.; Wang, X.; Lin, S.-S.; Dai, M.-J.; TUNG-HAN CHUANG | Surface and Coatings Technology | | | |
2018 | Electrolytic Migration of Ag-Pd Alloy Wires with Various Pd Contents | Lin, Y.-C.; Chen, C.-H.; He, Y.-Z.; Chen, S.-C.; Chuang, T.-H.; TUNG-HAN CHUANG | Journal of Electronic Materials | | | |
2009 | Electromigration of Sn-3Ag-0.5Cu and Sn-3Ag-0.5Cu-0.5Ce-0.2Zn solder joints with Au/Ni(P)/Cu and Ag/Cu pads | Lin, H.-J.; Lin, J.-S.; Chuang, T.-H.; TUNG-HAN CHUANG | Journal of Alloys and Compounds | | | |
2000 | Erosion- and wear-corrosion behavior of Fe-Mn-Al alloys in NaC1 solution | Huang, H.-H.; Chuang, T.-H.; TUNG-HAN CHUANG | Materials Science and Engineering A | | | |
2018 | Evaluation of corrosion resistance of ag-alloy bonding wires for electronic packaging | Chen, C.-H.; Lin, Y.-C.; Shih, Y.-T.; Chen, S.-C.; Tsai, C.-H.; Wang, S.-C.; Chuang, T.-H.; TUNG-HAN CHUANG | IEEE Transactions on Components, Packaging and Manufacturing Technology | | | |
2009 | Evaluations of whisker growth and fatigue reliability of Sn-3Ag-0.5Cu and Sn-3Ag-0.5Cu-0.05Ce solder ball grid array packages | Chuang, T.-H.; Cheng, C.-Y.; Chang, T.-C.; TUNG-HAN CHUANG | Journal of Electronic Materials | | | |
2007 | Extraordinary transmission through a silver film perforated with cross shaped hole arrays in a square lattice | Chen, C.-Y.; Tsai, M.-W.; Chuang, T.-H.; Chang, Y.-T.; Lee, S.-C.; SI-CHEN LEE | Applied Physics Letters | 59 | 54 | |
2008 | Fatigue life evaluation of ball grid array packages with Sn-Ag-Cu and rare-earth addition solder under cyclic bending test | Cheng, C.-Y.; Zhan, C.-J.; Chuang, T.-H.; TUNG-HAN CHUANG | 2008 3rd International Microsystems, Packaging, Assembly and Circuits Technology Conference, IMPACT 2008 | | | |
2009 | First shell substitution effects on hyperbranched polymers formed from monomers A2 and B3 with end-capping molecules | Cheng, K.-C.; Chuang, T.-H.; Tsai, T.-H.; Guo, W.; Su, W.-F.; WEI-FANG SU | European Polymer Journal | | | |
2013 | Formation and growth of intermetallics in an annealing-twinned Ag-8Au-3Pd wire bonding package during reliability tests | Chuang, T.-H.; Chang, C.-C.; Chuang, C.-H.; Lee, J.-D.; Tsai, H.-H.; TUNG-HAN CHUANG | IEEE Transactions on Components, Packaging and Manufacturing Technology | | | |
2011 | Functional interaction of Heat Shock protein 90 and beclin 1 modulates toll-like receptor-mediated autophagy | LI-CHUNG HSU ; Xu, C.; Liu, J.; Hsu, L.-C.; Luo, Y.; Xiang, R.; Chuang, T.-H. | FASEB Journal | 77 | 73 | |
2013 | High performance Ag-Pd alloy wires for high frequency IC packages | Tsai, H.-H.; Chuang, T.-H.; Lee, J.-D.; Tsai, C.-H.; Wang, H.-C.; Lin, H.-J.; Chang, C.-C.; TUNG-HAN CHUANG | Proceedings of Technical Papers - International Microsystems, Packaging, Assembly, and Circuits Technology Conference, IMPACT | | | |
2006 | High performance midinfrared narrow-band plasmonic thermal emitter | Tsai, M.-W.; Chuang, T.-H.; Meng, C.-Y.; Chang, Y.-T.; Lee, S.-C.; SI-CHEN LEE | Applied Physics Letters | 123 | 92 | |
2014 | Improvement of bonding strength of a (Pb, Sn)Te-Cu contact manufactured in a low temperature SLID-bonding process | Chuang, T.-H.; Yeh, W.-T.; Chuang, C.-H.; Hwang, J.-D.; TUNG-HAN CHUANG | Journal of Alloys and Compounds | | | |