公開日期 | 標題 | 作者 | 來源出版物 | scopus | WOS | 全文 |
2010 | Kinetic model of hyperbranched polymers formed by self-condensing vinyl or self-condensing ring-opening polymerization of AB monomers activated by stimuli with different reactivities | Cheng, K.-C.; Su, Y.-Y.; Chuang, T.-H.; Guo, W.; Su, W.-F.; WEI-FANG SU | Macromolecules | | | |
2020 | Lattice buffer effect of Ti film on the epitaxial growth of Ag nanotwins on Si substrates with various orientations | Chuang, T.-H.; Wu, P.-C.; Lin, Y.-C.; TUNG-HAN CHUANG | Materials Characterization | | | |
2016 | Low temperature bonding of Pd/Ni assembly for hydrogen purifier | Lin, Y.-C.; Chuang, C.-H.; Tsai, H.-H.; Chuang, T.-H.; TUNG-HAN CHUANG | Proceedings of the World Congress on Mechanical, Chemical, and Material Engineering | | | |
2009 | Low temperature direct electroless nickel plating on silicon wafer | Jain, C.-C.; Wang, S.-S.; Chuang, T.-H.; Yang, S.-R.; TUNG-HAN CHUANG | Journal of the Chinese Institute of Engineers, Transactions of the Chinese Institute of Engineers,Series A/Chung-kuo Kung Ch'eng Hsuch K'an | | | |
2016 | Low-Temperature Bonding of Bi<inf>0.5</inf>Sb<inf>1.5</inf>Te<inf>3</inf> Thermoelectric Material with Cu Electrodes Using a Thin-Film In Interlayer | Lin, Y.-C.; Yang, C.-L.; Huang, J.-Y.; Jain, C.-C.; Hwang, J.-D.; Chu, H.-S.; Chen, S.-C.; Chuang, T.-H.; TUNG-HAN CHUANG | Metallurgical and Materials Transactions A: Physical Metallurgy and Materials Science | | | |
2020 | Lumen maintenance of ternary Ag-alloy wire bonded LED package after reliability tests | Yuan, J.-H.; Chuang, T.-H.; Chuang, J.-H.; TUNG-HAN CHUANG | Materials Science Forum | | | |
2019 | Luminous efficiency of pd-doped ag-alloy wire bonded led package after reliability tests | Yuan, J.-H.; Chuang, T.-H.; TUNG-HAN CHUANG | Materials Science Forum | | | |
2016 | Materials Characteristics of Ag-Alloy Wires and Their Applications in Advanced Packages | Tsai, C.-H.; Chuang, C.-H.; Tsai, H.-H.; Lee, J.-D.; Chang, D.; Lin, H.-J.; Chuang, T.-H.; TUNG-HAN CHUANG | IEEE Transactions on Components, Packaging and Manufacturing Technology | | | |
2014 | Mechanism of Electromigration in Ag-Alloy Bonding Wires with Different Pd and Au Content | Chuang, T.-H.; Lin, H.-J.; Wang, H.-C.; Chuang, C.-H.; Tsai, C.-H.; TUNG-HAN CHUANG | Journal of Electronic Materials | | | |
2018 | Mechanism of the Electromigration in Ag-Pd Alloy Bonding Wires | Chuang, T.-H.; Chen, C.-H.; TUNG-HAN CHUANG | Metallurgical and Materials Transactions A: Physical Metallurgy and Materials Science | | | |
2016 | Microstructures and optoelectronic properties of Cu<inf>x</inf>O films deposited by high-power impulse magnetron sputtering | Sun, H.; Wen, C.-K.; Chen, S.-C.; Chuang, T.-H.; Arab Pour Yazdi, M.; Sanchette, F.; Billard, A.; TUNG-HAN CHUANG | Journal of Alloys and Compounds | | | |
2017 | Microstructures and optoelectronic properties of nickel oxide films deposited by reactive magnetron sputtering at various working pressures of pure oxygen environment | Sun, H.; Chen, S.-C.; Hsu, S.-W.; Wen, C.-K.; Chuang, T.-H.; Wang, X.; TUNG-HAN CHUANG | Ceramics International | | | |
2016 | Microstructures, electrical and magnetic properties of (Ga, Co)-ZnO films by radio frequency magnetron co-sputtering | Chen, S.-C.; Wang, C.-H.; Sun, H.; Wen, C.-K.; Lu, C.-F.; Tsai, C.-L.; Fu, Y.-K.; Chuang, T.-H.; TUNG-HAN CHUANG | Surface and Coatings Technology | | | |
2008 | Model of hyperbranched polymers formed by monomers A2 and Bg with end-capping molecules | Cheng, K.-C.; Chuang, T.-H.; Tsai, T.-H.; Guo, W.; Su, W.-F.; WEI-FANG SU | European Polymer Journal | | | |
2003 | Morphology and kinetics of discontinuous precipitation and dissolution in an Fe-8.5Al-27Mn-1.0Si-0.92C alloy | Chang, S.-Y.; Wang, S.-S.; Tsao, L.-C.; Chuang, T.-H.; TUNG-HAN CHUANG | Metallurgical and Materials Transactions A: Physical Metallurgy and Materials Science | | | |
2020 | Nanostructure- And Orientation-Controlled Resistive Memory Behaviors of Carbohydrate- block-Polystyrene with Different Molecular Weights via Solvent Annealing | Chuang, T.-H.; Chiang, Y.-C.; Hsieh, H.-C.; Isono, T.; Huang, C.-W.; Borsali, R.; Satoh, T.; WEN-CHANG CHEN | ACS Applied Materials and Interfaces | 16 | 16 | |
2014 | Nickel-tin solid-liquid inter-diffusion bonding | Yu, C.-C.; Su, P.-C.; Bai, S.J.; Chuang, T.-H.; TUNG-HAN CHUANG | International Journal of Precision Engineering and Manufacturing | | | |
2007 | Observation of Fabry-P?rot-type surface plasmon on Ag film with perforated short-range 3×3 hole array arranged in long-range periodic structure | Chang, Y.-T.; Chuang, T.-H.; Tsai, M.-W.; Lai, M.-J.; Lee, S.-C.; SI-CHEN LEE | Applied Physics Letters | 6 | 3 | |
2017 | p-type cuprous oxide thin films with high conductivity deposited by high power impulse magnetron sputtering | Sun, H.; Chen, S.-C.; Wen, C.-K.; Chuang, T.-H.; Arab Pour Yazdi, M.; Sanchette, F.; Billard, A.; TUNG-HAN CHUANG | Ceramics International | | | |
2020 | p-type semi-transparent conductive NiO films with high deposition rate produced by superimposed high power impulse magnetron sputtering | Chuang, T.-H.; Wen, C.-K.; Chen, S.-C.; Liao, M.-H.; Liu, F.; Sun, H.; MING-HAN LIAO ; TUNG-HAN CHUANG | Ceramics International | | 10 | |