公開日期 | 標題 | 作者 | 來源出版物 | scopus | WOS | 全文 |
---|---|---|---|---|---|---|
2001 | Selective interfacial reaction between Ni and eutectic BiSn lead-free solder | Tao W.H.; Chen C.; Ho C.E.; Chen W.T.; C. ROBERT KAO | Chemistry of Materials | |||
2005 | Solid-state reactions between Ni and Sn-Ag-Cu solders with different Cu concentrations | Luo W.C.; Ho C.E.; Tsai J.Y.; Lin Y.L.; C. ROBERT KAO | Materials Science and Engineering A | |||
2002 | Strong effect of Cu concentration on the reaction between lead-free microelectronic solders and Ni | Ho C.E.; Lin Y.L.; C. ROBERT KAO | Chemistry of Materials | 77 | 73 | |
2006 | Strong Zn concentration effect on the soldering reactions between Sn-based solders and Cu | Yang S.C.; Ho C.E.; Chang C.W.; C. ROBERT KAO | Journal of Materials Research | |||
2005 | Volume effect on the soldering reaction between SnAgCu solders and Ni | Ho C.E.; Lin Y.W.; Yang S.C.; C. ROBERT KAO | International Symposium and Exhibition on Advanced Packaging Materials Processes, Properties and Interfaces |