公開日期 | 標題 | 作者 | 來源出版物 | scopus | WOS | 全文 |
1999 | Reaction kinetics of the solder-balls with pads in BGA packages during reflow soldering | Ho, C. E.; Chen, Y. M.; Kao, and C. R. | Journal of Electronic Materials | | | |
2001 | Reaction of solder with Ni/Au metallization for electronic packages during reflow soldering | Ho, C. E.; Tsai, S. Y.; Kao, and C. R. | IEEE Transactions on Advanced Packaging | | | |
2002 | Reactions between SnAgCu lead-free solders and the Au/Ni surface finish in advanced electronic packages | Shiau, L. C.; Ho, C. E.; Kao, and C. R. | Soldering and Surface Mount Technology | | | |
2001 | Reflow soldering and isothermal solid-state aging of Sn-Ag eutectic solder on Au/Ni surface finish | Liu, C. M.; Ho, C. E.; Chen, W. T.; Kao, and C. R. | Journal of Electronic Materials | | | |
2001 | Selective interfacial reaction between Ni and Eutectic BiSn lead-free solder | Tao, W. H.; Chen, C.; Ho, C. E.; Chen, W. T.; Kao, and C. R. | Chemistry of Materials | | | |
2005 | Solid-state reactions between Ni and tin-silver-copper solders with different Cu concentrations | Luo, W. C.; Ho, C. E.; Tsai, J. Y.; Lin, Y. L.; Kao, and C. R. | Materials Science and Engineering A | | | |
2004 | The study of microstructure evolution of tin grains due to electromigration by using synchrotron X-ray microdiffraction | Wu, A. T.; Tu, K. N.; Lloyd, J. R.; Tamura, N.; Valek, B. C.; Kao, and C. R. | TMS Letters | | | |
2003 | A Study on the Reaction between Cu and Sn-3.5Ag Solder Doped with Small Amounts of Ni | Tsai, J. Y.; Hu, Y. C.; Tsai, C. M.; Kao, and C. R. | Journal of Electronic Materials | | | |
2000 | Using tert-butyl alcohol as an adductive agent for separation of an m-cresol and 2,6-xylenol mixture | Lee, L. S.; Lin, C. W.; Kao, and C. R. | Industrial and Engineering Chemistry Research | | | |