公開日期 | 標題 | 作者 | 來源出版物 | scopus | WOS | 全文 |
2019 | Hydrolysis-Tolerant Hybrid Bonding in Ambient Atmosphere for 3D Integration | Shigetou, A.; Yang, T.H.; Kao, C.R.; C. ROBERT KAO | IEEE 2019 International 3D Systems Integration Conference, 3DIC 2019 | 0 | 0 | |
2006 | In-Situ Observation of Material Migration in Flip-Chip Solder Joints under Current Stressing | Tsai, C.M.; Lai, Yi-Shao; Lin, Y.L.; Chang, C.W.; Kao, C.R. | Journal of Electronic Materials | | | |
2019 | Interfacial reactions of cu and in for low-temperature processes | Wang, Y.-W.; Kao, C.R.; C. ROBERT KAO | 2019 IEEE 21st Electronics Packaging Technology Conference, EPTC 2019 | 2 | 0 | |
2008 | Lead-free and lead-bearing electronic solders: Implementation, reliability, and new technology | Kao, C.R.; C. ROBERT KAO | JOM | 0 | 0 | |
2019 | Micropillar mechanics of Sn-based intermetallic compounds | Yu, J.J.; Wu, J.Y.; Yu, L.J.; Kao, C.R.; C. ROBERT KAO | Handbook of Mechanics of Materials | 2 | 0 | |
2020 | Phase stabilities and interfacial reactions of the Cu�VIn binary systems | Lin, Y.F.; Hung, H.T.; Yu, H.Y.; Kao, C.R.; Wang, Y.W.; C. ROBERT KAO | Journal of Materials Science: Materials in Electronics | 10 | 8 | |
2020 | Prior-to-bond annealing effects on the diamond-to-copper heterogeneous integration using silver�Vindium multilayer structure | Sheikhi, R.; Huo, Y.; Tsai, C.-H.; Kao, C.R.; Shi, F.G.; Lee, C.C.; C. ROBERT KAO | Journal of Materials Science: Materials in Electronics | 7 | 5 | |
2020 | Sintered Micro-Silver Paste Doped with Indium for Die Attachment Applications of Power ICs | Tsai, C.-H.; Huang, W.-C.; Kao, C.R.; Chew, L.M.; Schmitt, W.; Nishikawa, H.; C. ROBERT KAO | Proceedings - Electronic Components and Technology Conference | 3 | 0 | |
2006 | Strong Zn concentration effect on the soldering reactions between Sn-based solders and Cu | Yang, S.C.; Ho, C.E.; Chang, C.W.; Kao, C.R. | Journal of Materials Research | | | |
2008 | Tin Whisker Growth Induced by High Electron Current Density | Lin, Y.W.; Lai, Yi-shao; Lin, Y.L.; Tu, Chun-Te; Kao, C.R. | Journal of Electronic Materials | | | |
2020 | Vertical Interconnections by Electroless Au Deposition on Electroless Ni Immersion Au Surface Finish | Weng, I.A.; Hung, H.T.; Huang, W.C.; Kao, C.R.; Chen, Y.H.; C. ROBERT KAO | Journal of Electronic Materials | 6 | 5 | |