公開日期 | 標題 | 作者 | 來源出版物 | scopus | WOS | 全文 |
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2014 | Thermal fatigue life and reliability evaluation of die attachment layer of high power LED under thermal cycling conditions | Hsu Y.; Wu W.-F. ; Lai S.-L. | 2014 International Conference on Information Science, Electronics and Electrical Engineering | 1 | 0 |