公開日期 | 標題 | 作者 | 來源出版物 | scopus | WOS | 全文 |
2013 | The demonstration of nonlinear analytic model for the strain field induced by thermal copper filled TSVs (through silicon via) | Liao, M.-H. ; Chen, C.-H.; Lee, J.J.; Chen, K.C.; JYH-JONE LEE | 2013 e-Manufacturing and Design Collaboration Symposium | 0 | 0 | |
2018 | Thickness dependence of electrical conductivity and thermo-electric power of Bi<inf>2.0</inf>Te<inf>2.7</inf>Se<inf>0.3</inf>/Bi<inf>0.4</inf>Te<inf>3.0</inf>Sb<inf>1.6</inf> thermo-electric devices | Liao, M.-H.; Huang, K.-C.; Tsai, F.-A.; Liu, C.-Y.; Lien, C.; Lee, M.-H.; MING-HAN LIAO | AIP Advances | 9 | 9 | |
2015 | Triarylamine-based crosslinked hole-transporting material with an ionic dopant for high-performance PEDOT:PSS-free polymer solar cells | Tsai, C.-E.; Liao, M.-H.; Chen, Y.-L.; Cheng, S.-W.; Lai, Y.-Y.; Cheng, Y.-J.; Hsu, C.-S.; YU-YING LAI | Journal of Materials Chemistry C | 27 | 23 | |
2014 | Understanding the Core-Halo relation of quantum wave dark matter from 3D simulations | Liao, M.-H.; Wong, S.-K.; Broadhurst, T.; W-Y HWANG ; TZI-HONG CHIUEH ; TAK-PONG WOO ; HSI-YU SCHIVE | Physical Review Letters | 320 | 304 | |