公開日期 | 標題 | 作者 | 來源出版物 | scopus | WOS | 全文 |
---|---|---|---|---|---|---|
2013 | Development of millimeter-wave passive components and system-in-packages by LTCC technology | R.-B. Wu; T.-M. Shen; T.-Y. Huang; RUEY-BEEI WU | Asia-Pacific Microwave Conference | 1 | 0 | |
2012 | Development of wideband electrically identical fan-out structure for 60 GHz frontend phased array system in package module | T.-Y. Huang; R.-B. Wu; RUEY-BEEI WU | Asia-Pacific Microwave Conference | 1 | 0 | |
2011 | Direct eye diagram optimization for arbitrary transmission lines using FIR filter | Y.-S. Cheng; R.-B. Wu; RUEY-BEEI WU | IEEE Transactions on Components, Packaging, and Manufacturing Technology | 16 | 15 | |
2011 | Dual-band laminated waveguide filter design in multilayer LTCC | C. C. Chen; B.-J. Chen; T.-M. Shen; R.-B. Wu; RUEY-BEEI WU | Asia Pacific Microwave Conference | 5 | ||
2010 | Dual-band rat-race coupler design in multilayer LTCC | T.-M. Shen; C.-R. Chen; T.-Y. Huang; R.-B. Wu; RUEY-BEEI WU | 2010 Asia-Pacific Microwave Conference | 6 | ||
2006 | Dual-band/broadband circular polarizers designed with cascaded dielectric septum loadings | T.-Y. Huang; Y.-C. Yu; R.-B. Wu; RUEY-BEEI WU | Progress in Electromagnetics Research Symposium | 5 | ||
2005 | EBG-enhanced split power planes for wideband noise suppression | C.-L. Wang; G.-H. Shiue; R.-B. Wu; RUEY-BEEI WU | 14th Topical Meeting on Electrical Performance of Electronic Packaging 2005 | 1 | 0 | |
2014 | Efficient multi-node optimal placement for decoupling capacitors on PCB | S.-Y. Huang; Y.-S. Cheng; C.-Y. Huang; B. Liu; S. Chang; D. Chiang; P. Gu; R.-B. Wu; RUEY-BEEI WU | IEEE 18th Workshop on Signal and Power Integrity (SPI) | 7 | 0 | |
2012 | Enhanced eye-height estimation of mismatched lossy transmission lines | S.-Y. Huang; Y.-S. Cheng; B. Liu; R.-B. Wu; RUEY-BEEI WU | IEEE 21st Topical Meeting on Electrical Performance of Electronic Packaging and Systems | 2 | 0 | |
2018 | Eye diagram estimation and equalizer design method for PAM4 | W.-J. Chang; R.-B. Wu; RUEY-BEEI WU | 22nd IEEE Workshop Signal Power Integrity | 2 | 0 | |
2014 | Fast Prediction and optimal design for eye-height performance of mismatched transmission lines | S.-Y. Huang; R.-B. Wu; RUEY-BEEI WU | IEEE Transactions on Components, Packaging, and Manufacturing Technology | 6 | 5 | |
2008 | Fewest vias design for microstrip guard trace by using overlying dielectric | Y.-S. Cheng; W.-D. Guo; G.-H.Shiue; H.-H. Cheng; C.-C. Wang; R.-B. Wu; RUEY-BEEI WU | IEEE 17th Topical Meeting on Electrical Performance of Electronic Packaging | 18 | 0 | |
2006 | Frequency tenability of terahertz photonic transmitter | T. F. Kao; H. H. Chang; L. J. Chen; J. Y. Lu; A. S. Liu; Y. C. Yu; R.-B. Wu; W. S. Liu; J. I. Chyi; C. K. Sun; RUEY-BEEI WU | Applied Physics Letters | |||
2010 | Guard trace design for improvement on transient waveforms and eye diagrams of serpentine delay lines | G.-H. Shiue; C.-Y. Chao; W.-D. Guo; R.-B. Wu; RUEY-BEEI WU | IEEE Transactions on Advanced Packaging | 24 | 20 | |
2013 | Heat dissipation analysis and design of a board-level phased-array transmitter module for 60-GHz Communication | H.-C. Cheng; W.-R. Ciou; W.-H. Chen; J.-L. Kuo; H.-C. Lu; R.-B. Wu; HSIN-CHIA LU ; RUEY-BEEI WU | Applied Thermal Engineering | |||
2006 | Hybrid TIE/FDTD method for open boundary coupling between isolation islands | C. T. Wu; R.-B. Wu; RUEY-BEEI WU | IEEE Transactions on Advanced Packaging | 1 | 1 | |
2005 | Ka-band 32-GHz planar integrated switched-beam smart antenna | A.-S. Liu; H.-S. Wu; C.-K. C. Tzuang; R.-B. Wu; RUEY-BEEI WU | IEEE MTT-S International Microwave Symposium Digest, 2005. | 10 | 0 | |
2011 | LTCC embedded laminated waveguide filters and couplers for microwave SiP applications | T.-Y. Huang; T.-M. Shen; R.-B. Wu; RUEY-BEEI WU | 2011 Electronic Design of Advanced Packaging and Systems | 1 | 0 | |
2006 | Microstrip diplexers design with common resonator sections for compact size, but high isolation | C. F. Chen; F. Y. Huang; C. P. Chou; R.-B. Wu; RUEY-BEEI WU | IEEE Transactions on Microwave Theory and Techniques | 253 | 220 | |
2013 | Millimeter-wave non-contact flip-chip Transitions with Chebyshev filtering response using coupled microstrip resonators | H.-Y. Tsai; T.-Y. Huang; T.-M. Shen; R.-B. Wu; RUEY-BEEI WU | Asia-Pacific Microwave Conference | 1 | 0 |