公開日期 | 標題 | 作者 | 來源出版物 | scopus | WOS | 全文 |
---|---|---|---|---|---|---|
2005 | EBG-enhanced split power planes for wideband noise suppression | C.-L. Wang; G.-H. Shiue; R.-B. Wu; RUEY-BEEI WU | 14th Topical Meeting on Electrical Performance of Electronic Packaging 2005 | 1 | 0 | |
2014 | Efficient multi-node optimal placement for decoupling capacitors on PCB | S.-Y. Huang; Y.-S. Cheng; C.-Y. Huang; B. Liu; S. Chang; D. Chiang; P. Gu; R.-B. Wu; RUEY-BEEI WU | IEEE 18th Workshop on Signal and Power Integrity (SPI) | 7 | 0 | |
2012 | Enhanced eye-height estimation of mismatched lossy transmission lines | S.-Y. Huang; Y.-S. Cheng; B. Liu; R.-B. Wu; RUEY-BEEI WU | IEEE 21st Topical Meeting on Electrical Performance of Electronic Packaging and Systems | 2 | 0 | |
2018 | Eye diagram estimation and equalizer design method for PAM4 | W.-J. Chang; R.-B. Wu; RUEY-BEEI WU | 22nd IEEE Workshop Signal Power Integrity | 2 | 0 | |
2014 | Fast Prediction and optimal design for eye-height performance of mismatched transmission lines | S.-Y. Huang; R.-B. Wu; RUEY-BEEI WU | IEEE Transactions on Components, Packaging, and Manufacturing Technology | 6 | 5 | |
2008 | Fewest vias design for microstrip guard trace by using overlying dielectric | Y.-S. Cheng; W.-D. Guo; G.-H.Shiue; H.-H. Cheng; C.-C. Wang; R.-B. Wu; RUEY-BEEI WU | IEEE 17th Topical Meeting on Electrical Performance of Electronic Packaging | 18 | 0 | |
2006 | Frequency tenability of terahertz photonic transmitter | T. F. Kao; H. H. Chang; L. J. Chen; J. Y. Lu; A. S. Liu; Y. C. Yu; R.-B. Wu; W. S. Liu; J. I. Chyi; C. K. Sun; RUEY-BEEI WU | Applied Physics Letters | |||
2010 | Guard trace design for improvement on transient waveforms and eye diagrams of serpentine delay lines | G.-H. Shiue; C.-Y. Chao; W.-D. Guo; R.-B. Wu; RUEY-BEEI WU | IEEE Transactions on Advanced Packaging | 24 | 20 | |
2013 | Heat dissipation analysis and design of a board-level phased-array transmitter module for 60-GHz Communication | H.-C. Cheng; W.-R. Ciou; W.-H. Chen; J.-L. Kuo; H.-C. Lu; R.-B. Wu; HSIN-CHIA LU ; RUEY-BEEI WU | Applied Thermal Engineering | |||
2006 | Hybrid TIE/FDTD method for open boundary coupling between isolation islands | C. T. Wu; R.-B. Wu; RUEY-BEEI WU | IEEE Transactions on Advanced Packaging | 1 | 1 | |
2005 | Ka-band 32-GHz planar integrated switched-beam smart antenna | A.-S. Liu; H.-S. Wu; C.-K. C. Tzuang; R.-B. Wu; RUEY-BEEI WU | IEEE MTT-S International Microwave Symposium Digest, 2005. | 10 | 0 | |
2011 | LTCC embedded laminated waveguide filters and couplers for microwave SiP applications | T.-Y. Huang; T.-M. Shen; R.-B. Wu; RUEY-BEEI WU | 2011 Electronic Design of Advanced Packaging and Systems | 1 | 0 | |
2006 | Microstrip diplexers design with common resonator sections for compact size, but high isolation | C. F. Chen; F. Y. Huang; C. P. Chou; R.-B. Wu; RUEY-BEEI WU | IEEE Transactions on Microwave Theory and Techniques | 253 | 220 | |
2013 | Millimeter-wave non-contact flip-chip Transitions with Chebyshev filtering response using coupled microstrip resonators | H.-Y. Tsai; T.-Y. Huang; T.-M. Shen; R.-B. Wu; RUEY-BEEI WU | Asia-Pacific Microwave Conference | 1 | 0 | |
2006 | Miniaturized microstrip quasi-elliptical bandpass filters using slotted resonators | C.-F. Chen; T.-Y. Huang; R.-B. Wu; RUEY-BEEI WU | 2006 IEEE International Microwave Symposium | 9 | 0 | |
2009 | Miniaturized rat-race coupler with bandpass response and good stopband rejection | W.-H. Wang; T.-M. Shen; T.-Y. Huang; R.-B. Wu; RUEY-BEEI WU | 2009 IEEE MTT-S International Microwave Symposium | 42 | 0 | |
2005 | Model-based optimization method for bandwidth enhancement of a series-fed printed dipole antenna array | Y. H. Liu; A. S. Liu; Y. H. Pang; Y. C. Lin; R.-B. Wu; C. C. Chen; RUEY-BEEI WU | Bulletin of the College of Engineering, NTU | |||
2014 | Modeling and fast eye- diagram estimation of ringing effects on branch line structures | K.-Y. Yang; T.-Y. Wu; W.-S. Wang; Y.-H. Lin; R.-B. Wu; RUEY-BEEI WU | IEEE Transactions on Components, Packaging, and Manufacturing Technology | 1 | 1 | |
2008 | Multilayer 180° hybrid in LTCC | T.-M. Shen; T.-Y. Hung; R.-B. Wu; RUEY-BEEI WU | 2008 Asia-Pacific Microwave Conference | 5 | 0 | |
2018 | Non-periodic flipped-SIR EBG for dual-band SSN mitigation in 2-layer PCB | Y.-C. Wang; H.-W. Chan; H.-C. Hsieh; Y.-H. Lin; W.-S. Wang; S.-H. Wang; R.-B. Wu; RUEY-BEEI WU | 2018 IEEE Electrical Design of Advanced Packaging and Systems | 1 | 0 |