公開日期 | 標題 | 作者 | 來源出版物 | scopus | WOS | 全文 |
---|---|---|---|---|---|---|
2021 | Grain Boundary Diffusion of Ni through Au-Doped Ni3Sn2 Intermetallic Compound for Technological Applications | Zhu Z.X; Renganathan V; C. ROBERT KAO | Journal of Electronic Materials | |||
2021 | Highly uniform microfluidic electroless interconnections for chip stacking applications | Hung H.T; Ma Z.D; Shih P.S; Huang J.H; Kao L.Y; Yang C.Y; Renganathan V; Kao C.L; Hung Y.C; C. ROBERT KAO | Electrochimica Acta | |||
2022 | Hydrothermally constructed AgWO4-rGO nanocomposites as an electrode enhancer for ultrasensitive electrochemical detection of hazardous herbicide crisquat | Maheshwaran S; Renganathan V; Chen S.-M; Balaji R; C. ROBERT KAO ; Chandrasekar N; Ethiraj S; Samuel M.S; Govarthanan M. | Chemosphere | 19 | 12 |