Issue Date | Title | Author(s) | Source | scopus | WOS | Fulltext/Archive link |
---|---|---|---|---|---|---|
2013 | Power distribution network modeling for 3-D ICs with TSV arrays | Shen, C.-K.; Lu, Y.-C.; Chiou, Y.-P.; Cheng, T.-Y.; Wu, T.-L.; YI-CHANG LU ; TZONG-LIN WU | Asia and South Pacific Design Automation Conference, ASP-DAC | |||
2016 | Study of frequency offset behavior for artificial magnetic structure in compact mobile device | Liu, C.-Y.; Shen, C.-K.; Chen, S.-Y.; Wu, T.-L.; Chang, J.; Tseng, B.-C.; Yen, J.; SHIH-YUAN CHEN | 2016 IEEE Antennas and Propagation Society International Symposium, APSURSI 2016 - Proceedings | |||
2009 | Vertical electrothermal actuator with separated metal and nitride structural layers | Tsai, J.-C.; Lai, R.-J.; Yin, C.-Y.; Chen, D.-S.; Shen, C.-K.; Chang, Y.-T.; JUI-CHE TSAI | Journal of Micro/Nanolithography, MEMS, and MOEMS | 3 | 2 |