公開日期 | 標題 | 作者 | 來源出版物 | scopus | WOS | 全文 |
---|---|---|---|---|---|---|
2006 | Characterizing package/PCB PDN interactions from a full-wave finite-difference formulation | S. Sun; D. Pommerenke; J. Drewniak; K. Xiao; S.-T. Chen; T.-L. Wu; TZONG-LIN WU | IEEE Int. Symp. Electromagn. Compat. | 7 | ||
2004 | Chip-level model of switching noise coupling on integrated system combining package and printed circuit board | S.-T. Chen; C.-W. Tsai; S.-M. Wu; C.-P. Hung; T.-L. Wu; TZONG-LIN WU | IEEE Int. Symp. Electromagn. Compat. Eur. Workshop | |||
2018 | A Common-Mode Filter with Three Alterable and Designable Transmission Zeroes | C.-H. Cheng; T.-L. Wu; TZONG-LIN WU | International Symposium on Electromagnetic Compatibility (EMC EUROPE) | 0 | 0 | |
2016 | Compact Cascaded-Spiral-Patch EBG Structure for Broadband SSN Mitigation in WLAN Applications | C.-K. Shen; S. Chen; T.-L. Wu; TZONG-LIN WU | IEEE Transactions on Microwave Theory and Techniques | 19 | 16 | |
2015 | Compact Hybrid Open Stub EBG Structure for Power Noise Suppression in WLAN Band | C.-K. Shen; T.-L. Wu; TZONG-LIN WU | Joint IEEE Int. Symp. Electromag. Compat. and EMC Europe | 4 | 0 | |
2013 | Compact TSV-based wideband bandpass filters on 3-D IC | Y.-C. Tseng; P.-S. Chen; W.-C. Lo; S.-H. Wu; T.-L. Wu; TZONG-LIN WU | IEEE 63rd Electronic Components and Technology Conference | 7 | 0 | |
2015 | Compact Wideband Balanced Filter for Eliminating Radio-Frequency Interference on Differentially-fed Antennas | Y.-C. Tseng; P.-Y. Weng; T.-L. Wu; TZONG-LIN WU | Joint IEEE Int. Symp. Electromag. Compat. and EMC Europe | 4 | 0 | |
2017 | The competitions of electromagnetic for undergraduate students in Taiwan: Taiwan creative electromagnetic implementation competition T-CEIC | Z.-M. Tsai; R.-B. Wu; T.-L. Wu; S.-Y. Chen; S.-G. Mao; T.-G. Ma; RUEY-BEEI WU | IEEE International Conference on Computational Electromagnetics (ICCEM) | 0 | 0 | |
2010 | Conformal shielding investigation for SiP modules | C.-H. Huang; C.-Y. Hsiao; C.-D Wang; T. Chen; K.-H. Liao; T.-L. Wu; TZONG-LIN WU | Elect. Design Adv. Packag. Systems Symp. | 13 | 0 | |
2003 | Coupling effect of ground bounce noise for ball grid array (BGA) package mounted on printed circuit boards (PCB) | S.-T. Chen; C.-W. Tsai; S.-M. Wu; C.-P. Hung; T.-L. Wu; TZONG-LIN WU | Taiwan Electromagn. Compat. Conf. | |||
2002 | Coupling of the ground bounce noise to the signal trace with via transition in partitioned power bus of PCB | J.-N. Hwang; T.-L. Wu; TZONG-LIN WU | IEEE Int. Symp. Electromagn. Compat. | 25 | ||
2001 | Crosstalk characterization of high-speed interconnects in time-domain | C.-C. Kuo; Y.-H. Lin; T.-L. Wu; TZONG-LIN WU | IEEE Int. Symp. Electromagn. Compat. | 3 | ||
2010 | Design and implementation of a novel hybrid photonic crystal power/ground layer for broadband power noise suppression | G.-Z. Wu; Y.-C. Chen; T.-L. Wu; TZONG-LIN WU | IEEE Transactions on Advanced Packaging | 18 | 13 | |
2016 | Design and Modeling of an Absorptive Frequency Selective Surface with Several Transmissive Bands | C.-W. Lin; C.-K. Shen; T.-L. Wu; TZONG-LIN WU | IEEE Electrical Design of Advanced Packaging and Systems (EDAPS) | 2 | 0 | |
2010 | Design and modelling of miniaturized bandgap structure for wideband GHz-noise suppression based on LTCC technology | W.-Y. Huang; T.-K. Wang; T.-L. Wu; TZONG-LIN WU | IEEE Transactions on Advanced Packaging | 1 | 1 | |
2012 | Design considerations for radio frequency 3DICs | Y.-C. Tseng; C.-B. Chang; C.-K. Tang; C.-H. Cheng; Y.-C. Lu; K.-Y. Lin; T.-L. Wu; R.-B. Wu; YI-CHANG LU ; TZONG-LIN WU ; RUEY-BEEI WU ; KUN-YOU LIN | IEEE Elect. Design Adv. Packag. Systems Symp. | 0 | 0 | |
2015 | Design of On-Chip Microwave Filters in Integrated Fan-Out Wafer Level Packaging (InFO-WLP) Technology | C.-K. Shen; M.-H. Tsai; H.-N. Chen; C.-P. Jou; Sally Liu; F.-L. Hsueh; T.-L. Wu; TZONG-LIN WU | Asia-Pacific Int. Symp. Electronmagn. Compat. | 1 | 0 | |
2016 | E shape resonator dualband common mode filter | C.-Y. Lin; T.-L. Wu; TZONG-LIN WU | IEEE 25th Conference on Electrical Performance Of Electronic Packaging And Systems (EPEPS) | 3 | 0 | |
2015 | Effective Current Distribution Analysis Method for Multiconductor-Transmission-Line (MTL) System with Arbirary Conductor Number Variation | C.-H. Cheng,; T.-L. Wu; TZONG-LIN WU | Joint IEEE Int. Symp. Electromag. Compat. and EMC Europe | 1 | 0 | |
2003 | Effective electromagnetic shielding of plastic packaging in low-cost optical transceiver modules | T.-L. Wu; W.-S. Jou; S.-G. Dai; W.-H. Cheng; TZONG-LIN WU | Journal of Lightwave Technology | 25 | 22 |