公開日期 | 標題 | 作者 | 來源出版物 | scopus | WOS | 全文 |
---|---|---|---|---|---|---|
2011 | Magneto-resistive sensor readout circuit and field canceling system in next generation nano-fab | F.-C. Chuang; Y.-L. Song; C. Yu; S.-K. Hsu; T.-L. Wu; L.-M. Chang; TZONG-LIN WU | Asia-Pacific Int. Symp. Electronmagn. Compat. | |||
2018 | A Miniature Electromagnetic Bandgap Structure Using Integrated Fan-Out Wafer-Level Package (InFO-WLP) for Gigahertz Noise Suppression | M.-H. Tsai; S.-K. Hsu; C.-K. Shen; P.-S. Wei; C.-H. Chern; T.-L. Wu; TZONG-LIN WU | IEEE/MTT-S International Microwave Symposium | 3 | 0 | |
2014 | Miniaturization technique for forward-wave directional couplers by using open stubs and patterned ground structures | S.-K. Hsu; C.-C. Tseng; T.-L. Wu; TZONG-LIN WU | Asia-Pacific Microw. Conference (APMC) | 1 | ||
2014 | Miniaturized and bandwidth-enhanced multilayer 1-D EBG structure for power noise suppression | C.-K. Shen; T.-L. Wu; C.-H. Chen; D.-H. Han; TZONG-LIN WU | IEEE. Int. Symp. Electromagn. Compat. | 6 | 0 | |
2010 | Mitigation of noise coupling in multilayer high-speed PCB: state of the art modeling methodology and EBG technology | T.-L. Wu; J. Fan; F. d. Paulis; C.-D. Wang; A. C. Scogna; A. Orl; i; Wu, Tzong-Lin | IEICE Transactions on Communications | 20 | 13 | |
2013 | Model and mechanism of miniaturized and stopband-enhanced interleaved EBG structure for power/ground noise suppression | C.-D. Wang; T.-L. Wu; TZONG-LIN WU | IEEE Transactions on Electromagnetic Compatibility | 28 | 13 | |
2015 | Modeling and Analysis of Bandwidth-Enhanced Multilayer 1-D EBG With Bandgap Aggregation for Power Noise Suppression | C.-K. Shen; C.-H. Chen; D.-H. Han; T.-L. Wu; TZONG-LIN WU | IEEE Transactions on Electromagnetic Compatibility | 6 | 6 | |
2007 | Modeling noise coupling between package and PCB power/ground planes with an efficient 2-D FDTD/lumped element method | T.-K. Wang; S.-T. Chen; C.-W. Tsai; S.-M. Wu; J. J. Drewniak; T.-L. Wu; TZONG-LIN WU | IEEE Transactions on Advanced Packaging | 30 | 22 | |
2011 | Mold-based compartment shielding to mitigate the intra-system coupled noise on SiP modules | C.-Y. Hsiao; C.-H. Huang; C.-D. Wang; K.-H. Liao; C.-H. Shen; C.-C. Wang; T.-L. Wu; TZONG-LIN WU | IEEE. Int. Symp. Electromagn. Compat. | 17 | 0 | |
2017 | A Novel Absorptive Common-Mode Filter for Cable Radiation Reduction | P.-J. Li; Y.-C. Tseng; C.-H. Cheng; T.-L. Wu; TZONG-LIN WU | IEEE Transactions on Components, Packaging, and Manufacturing Technology | 29 | 27 | |
2016 | Novel Absorptive Design of Common-Mode Filter at Desired Frequency Band | P.-J. Li; C.-H. Cheng; Y.-C. Tseng; T.-L. Wu; TZONG-LIN WU | IEEE 20th Workshop on Signal and Power Integrity (SPI) | 4 | 0 | |
2017 | A Novel and Compact Eight-Port Forward-Wave Directional Coupler With Arbitrary Coupling Level Design Using Four-Mode Control Technology | H.-L. Ting; S.-K. Hsu; T.-L. Wu; TZONG-LIN WU | IEEE Transactions on Microwave Theory and Techniques | 23 | 24 | |
2013 | Novel differential-mode equalizer with broadband common-mode filtering for Gb/s differential-signal transmission | Y.-J. Cheng; H.-H. Chuang; C.-K. Cheng; T.-L. Wu; TZONG-LIN WU | IEEE Transactions on Components, Packaging and Manufacturing Technology | 18 | 17 | |
2001 | NSTL evaluation of the compact EMC chamber with absorbers being partially lined on the floor ground | L.-R. Chen; Y.-H. Lin; T.-L. Wu; TZONG-LIN WU | Electromagn. Compat. Conf. | |||
2002 | NSTL evaluation of the compact EMC chamber with ferrite tiles being partially lined on the floor ground | L.-R. Chen; Y.-H. Lin; T.-L. Wu; TZONG-LIN WU | IEEE Int. Symp. Electromagn. Compat. | 1 | ||
2004 | Numerical and experimental investigation of radiation caused by the switching noise on the partitioned DC reference planes of high speed digital PCB | T.-L. Wu; S.-T. Chen; J.-N. Huang; Y.-H. Lin; TZONG-LIN WU | IEEE Transactions on Electromagnetic Compatibility | 97 | 71 | |
1998 | Numerical modeling of weakly fused fiber-optic polarization beamsplitter - part II: the three-dimensional electromagnetic model | S.-W. Yang; T.-L. Wu; C.-W. Wu; H.-C. Chang; TZONG-LIN WU | Journal of Lightwave Technology(SCI) | 43 | 28 | |
2011 | Optimal permutation of power transmission line at high technology nano-fab to decrease electromagnetic influence | Y.-L. Song; C.Yu; F.-C. Chuang; Y.-C. Tseng; J.-Y. Zou; S.-K. Hsu; T.-G. Ma; T.-L. Wu; L.-M. Chang; TZONG-LIN WU | Annu. Symp. Antenna Meas. Tech. Association | |||
2010 | Overview of power integrity solutions on package and PCB: decoupling and EBG isolation | T.-L. Wu; H.-H. Chuang; T.-K. Wang; Wu, Tzong-Lin | IEEE Transactions on Electromagnetic Compatibility | 196 | 161 | |
2013 | Overview of signal integrity and EMC design technologies on PCB:fundamentals and latest progress | T.-L. Wu; F. Buesink; F. Canavero; TZONG-LIN WU | IEEE Transactions on Electromagnetic Compatibility | 170 | 145 |