公開日期 | 標題 | 作者 | 來源出版物 | scopus | WOS | 全文 |
---|---|---|---|---|---|---|
2017 | A Novel Absorptive Common-Mode Filter for Cable Radiation Reduction | P.-J. Li; Y.-C. Tseng; C.-H. Cheng; T.-L. Wu; TZONG-LIN WU | IEEE Transactions on Components, Packaging, and Manufacturing Technology | 29 | 27 | |
2016 | Novel Absorptive Design of Common-Mode Filter at Desired Frequency Band | P.-J. Li; C.-H. Cheng; Y.-C. Tseng; T.-L. Wu; TZONG-LIN WU | IEEE 20th Workshop on Signal and Power Integrity (SPI) | 4 | 0 | |
2017 | A Novel and Compact Eight-Port Forward-Wave Directional Coupler With Arbitrary Coupling Level Design Using Four-Mode Control Technology | H.-L. Ting; S.-K. Hsu; T.-L. Wu; TZONG-LIN WU | IEEE Transactions on Microwave Theory and Techniques | 23 | 24 | |
2013 | Novel differential-mode equalizer with broadband common-mode filtering for Gb/s differential-signal transmission | Y.-J. Cheng; H.-H. Chuang; C.-K. Cheng; T.-L. Wu; TZONG-LIN WU | IEEE Transactions on Components, Packaging and Manufacturing Technology | 18 | 17 | |
2001 | NSTL evaluation of the compact EMC chamber with absorbers being partially lined on the floor ground | L.-R. Chen; Y.-H. Lin; T.-L. Wu; TZONG-LIN WU | Electromagn. Compat. Conf. | |||
2002 | NSTL evaluation of the compact EMC chamber with ferrite tiles being partially lined on the floor ground | L.-R. Chen; Y.-H. Lin; T.-L. Wu; TZONG-LIN WU | IEEE Int. Symp. Electromagn. Compat. | 1 | ||
2004 | Numerical and experimental investigation of radiation caused by the switching noise on the partitioned DC reference planes of high speed digital PCB | T.-L. Wu; S.-T. Chen; J.-N. Huang; Y.-H. Lin; TZONG-LIN WU | IEEE Transactions on Electromagnetic Compatibility | 97 | 71 | |
1998 | Numerical modeling of weakly fused fiber-optic polarization beamsplitter - part II: the three-dimensional electromagnetic model | S.-W. Yang; T.-L. Wu; C.-W. Wu; H.-C. Chang; TZONG-LIN WU | Journal of Lightwave Technology(SCI) | 43 | 28 | |
2011 | Optimal permutation of power transmission line at high technology nano-fab to decrease electromagnetic influence | Y.-L. Song; C.Yu; F.-C. Chuang; Y.-C. Tseng; J.-Y. Zou; S.-K. Hsu; T.-G. Ma; T.-L. Wu; L.-M. Chang; TZONG-LIN WU | Annu. Symp. Antenna Meas. Tech. Association | |||
2010 | Overview of power integrity solutions on package and PCB: decoupling and EBG isolation | T.-L. Wu; H.-H. Chuang; T.-K. Wang; Wu, Tzong-Lin | IEEE Transactions on Electromagnetic Compatibility | 196 | 161 | |
2013 | Overview of signal integrity and EMC design technologies on PCB:fundamentals and latest progress | T.-L. Wu; F. Buesink; F. Canavero; TZONG-LIN WU | IEEE Transactions on Electromagnetic Compatibility | 170 | 145 | |
2008 | Parallel-plate noise isolation using a macro-via photonic crystal structure in advanced package | H.-H. Chuang; T.-L. Wu; T.-K. Wang; TZONG-LIN WU | Asia-Pacific Microw. Conf. | 0 | 0 | |
2010 | Parallel-plate noise suppression using a ground surface perturbation lattice (GSPL) structure | A. C. Scogna; C.-D. Wang; A. Orl; i; T.-L. Wu; TZONG-LIN WU | Asia-Pacific Symp. Electromagn. Compat. | |||
2004 | Photonic crystal fiber analysis through the vector boundary-element method: effect of elliptical air hole | T.-L. Wu; C.-H. Chao; TZONG-LIN WU | IEEE Photonics Technology Letters | 34 | 30 | |
2003 | Photonic crystal fiber analysis through vector boundary-element method | C.-H. Chao; T.-L. Wu; TZONG-LIN WU | Pacific Rim Conf. Lasers Electro-Optics | 0 | 0 | |
2005 | Photonic crystal pwer substrate for wideband suppression of power/ground bounce noise and radiated emission in high-speed packages | S.-T. Chen; T.-S. Horng; T.-L. Wu; TZONG-LIN WU | Asia-Pacific Symp. Electromagn. Compat. | |||
2005 | Polarization beam splitting in twin- elliptical-core photonic crystal fiber coupler | J.-S. Chiang; T.-L. Wu; TZONG-LIN WU | Int. Symp. Commun. | |||
2015 | Post-fabricated EBG Tape on Electronic Devices for RFI Mitigation in WLAN Bands | W.-Y. Hsu; C.-K. Shen; T.-L. Wu; Ch.-H. Chen; D.-H. Han; TZONG-LIN WU | IEEE Electrical Design of Advanced Packaging and Systems (EDAPS) Symposium | 1 | 0 | |
2008 | Power integrity chip-package-PCB co-Simulation for I/O interface of DDR3 high-speed memory | H.-H. Chuang; S.-J. Wu; M.-Z. Hong; D. Hsu; R. Huang; T.-L. Wu; TZONG-LIN WU | Elect. Design Adv. Packag. Systems Symp. | 12 | 0 | |
2006 | Power splitting analysis of 3×3 photonic crystal | H.-J. Ou; T.-S. Horng; T.-L. Wu; TZONG-LIN WU | Optoelectron. Commun. Conf. |