公開日期 | 標題 | 作者 | 來源出版物 | scopus | WOS | 全文 |
---|---|---|---|---|---|---|
2011 | Optimal permutation of power transmission line at high technology nano-fab to decrease electromagnetic influence | Y.-L. Song; C.Yu; F.-C. Chuang; Y.-C. Tseng; J.-Y. Zou; S.-K. Hsu; T.-G. Ma; T.-L. Wu; L.-M. Chang; TZONG-LIN WU | Annu. Symp. Antenna Meas. Tech. Association | |||
2010 | Overview of power integrity solutions on package and PCB: decoupling and EBG isolation | T.-L. Wu; H.-H. Chuang; T.-K. Wang; Wu, Tzong-Lin | IEEE Transactions on Electromagnetic Compatibility | 196 | 161 | |
2013 | Overview of signal integrity and EMC design technologies on PCB:fundamentals and latest progress | T.-L. Wu; F. Buesink; F. Canavero; TZONG-LIN WU | IEEE Transactions on Electromagnetic Compatibility | 170 | 145 | |
2008 | Parallel-plate noise isolation using a macro-via photonic crystal structure in advanced package | H.-H. Chuang; T.-L. Wu; T.-K. Wang; TZONG-LIN WU | Asia-Pacific Microw. Conf. | 0 | 0 | |
2010 | Parallel-plate noise suppression using a ground surface perturbation lattice (GSPL) structure | A. C. Scogna; C.-D. Wang; A. Orl; i; T.-L. Wu; TZONG-LIN WU | Asia-Pacific Symp. Electromagn. Compat. | |||
2004 | Photonic crystal fiber analysis through the vector boundary-element method: effect of elliptical air hole | T.-L. Wu; C.-H. Chao; TZONG-LIN WU | IEEE Photonics Technology Letters | 34 | 30 | |
2003 | Photonic crystal fiber analysis through vector boundary-element method | C.-H. Chao; T.-L. Wu; TZONG-LIN WU | Pacific Rim Conf. Lasers Electro-Optics | 0 | 0 | |
2005 | Photonic crystal pwer substrate for wideband suppression of power/ground bounce noise and radiated emission in high-speed packages | S.-T. Chen; T.-S. Horng; T.-L. Wu; TZONG-LIN WU | Asia-Pacific Symp. Electromagn. Compat. | |||
2005 | Polarization beam splitting in twin- elliptical-core photonic crystal fiber coupler | J.-S. Chiang; T.-L. Wu; TZONG-LIN WU | Int. Symp. Commun. | |||
2015 | Post-fabricated EBG Tape on Electronic Devices for RFI Mitigation in WLAN Bands | W.-Y. Hsu; C.-K. Shen; T.-L. Wu; Ch.-H. Chen; D.-H. Han; TZONG-LIN WU | IEEE Electrical Design of Advanced Packaging and Systems (EDAPS) Symposium | 1 | 0 | |
2008 | Power integrity chip-package-PCB co-Simulation for I/O interface of DDR3 high-speed memory | H.-H. Chuang; S.-J. Wu; M.-Z. Hong; D. Hsu; R. Huang; T.-L. Wu; TZONG-LIN WU | Elect. Design Adv. Packag. Systems Symp. | 12 | 0 | |
2006 | Power splitting analysis of 3×3 photonic crystal | H.-J. Ou; T.-S. Horng; T.-L. Wu; TZONG-LIN WU | Optoelectron. Commun. Conf. | |||
2016 | Promoting effective education in electromagnetics - Taiwan’s school of accessible and visualized electromagnetics (SAVE) formed | W.-J. Liao; R.-B. Wu; T.-L. Wu; T.-G. Ma; Y.-H. Pang; Z.-M. Tsai; H.-H. Yu; K.-M. Tu; H.-C. Lin; S. T. Peng; RUEY-BEEI WU | IEEE Antennas and Propagation Magazine | 5 | 4 | |
2016 | Promoting Effective Education in Electromagnetics - Taiwan��s School of Accessible and Visualized Electromagnetics Formed | W.-J. Liao; R.-B. Wu; T.-L. Wu; T.-G. Ma; Y.-H. Pang; Z.-M. Tsai; H.-H. Yu; K.-M. Tu; H.-C. Lin; S.-T. Peng; TZONG-LIN WU | IEEE Antennas and Propagation Magazine | |||
2016 | Radiation mechanism and solution of cable attached differential signals | P.-J. Li; Y.-C. Tseng; T.-L. Wu; TZONG-LIN WU | IEEE Asia-Pacific International Symposium on Electromagnetic Compatibility (APEMC) | 0 | 0 | |
2016 | A Radiation Prediction Method based on Partial Element Equivalent Circuit | Y.-A. Hsu; C.-C. Chou; C.-H. Cheng; T.-L. Wu; TZONG-LIN WU | IEEE Asia-Pacific International Symposium on Electromagnetic Compatibility (APEMC) | 1 | 0 | |
2012 | Radiation suppression for cable-attached packages utilizing a compact embedded common-mode filter | C.-Y. Hsiao; C.-H. Tsai; C.-N. Chiu; T.-L. Wu; TZONG-LIN WU | IEEE Transactions on Components, Packaging and Manufacturing Technology | 65 | 59 | |
2013 | Radio-Frequency Interference Mitigation Strategies for High-Speed Connectors | C.-Y. Hsiao; S.-H. Wang; C.-C Wang; W.-S. Wang; Y.-H. Lin; T.-L. Wu; TZONG-LIN WU | Elect. Design Adv. Packag. Systems Symp. | 6 | 0 | |
2014 | Recent progress of advanced microwave and system-in-package integration technologies at National Taiwan University | H. Wang; T.-L. Wu; P. Hsu; R.-B. Wu; K.-Y. Lin; T.-W. Huang; TZONG-LIN WU | Asia-Pacific Microw. Conference (APMC) | 0 | ||
2018 | A Resistor-Free Absorptive Common-Mode Filter Using Gap-Coupled Resonator | P.-J. Li; C.-H. Cheng; T.-L. Wu; TZONG-LIN WU | IEEE Microwave and Wireless Components Letters | 18 | 16 |