公開日期 | 標題 | 作者 | 來源出版物 | scopus | WOS | 全文 |
---|---|---|---|---|---|---|
2001 | The bridging effect of the isolation moat on the EMI caused by ground bounce noise between power/ground planes of PCB | J.-N. Hwang; T.-L. Wu; TZONG-LIN WU | IEEE Int. Symp. Electromagn. Compat. | 14 | ||
2001 | The effect of test system impedance on measurements of ground bounce in printed circuit boards | T.-L. Wu; Y.-H. Lin; J.-N. Huang; J.-J. Lin; TZONG-LIN WU | IEEE Transactions on Electromagnetic Compatibility | 7 | 6 | |
2013 | The effect of various skew compensation strategies on mode conversion and radiation from high-speed connectors | H.-C. Chen; S. Connor; T.-L. Wu; B. Archambeault; TZONG-LIN WU | IEEE Int. Symp. Electromagn. Compat. | 12 | 0 | |
2008 | The effects on SI and EMI for differential coupled microstrip lines over LPC-EBG power/ground planes | C.-H. Shih; G.-H. Shiue; T.-L. Wu; R.-B. Wu; TZONG-LIN WU ; RUEY-BEEI WU | Asia-Pacific Symp. Electromagn. Compat. | 7 | 0 | |
2006 | Theoretical demonstration of enhancement of light extraction of flip-chip GaN light-emitting diodes with photonic crystals | C.-H. Chao; S. L. Chuang; T.-L. Wu; TZONG-LIN WU | Applied Physics Letters | 52 | 43 | |
1995 | Three-dimensional modeling of fused biconical optical fiber coupling devices | H.-C. Chang; T.-L. Wu; C.-W. Wu; TZONG-LIN WU | Progress in Electromagn. Research Symp. | |||
2003 | Time-domain SPICE model for coupled interconnects using the multi-conductor layer peeling technique | C.-C. Kuo; T.-L. Wu; TZONG-LIN WU | Int. Zurich Symp. Technical Exhibit. Electromagn. Compat. | |||
2015 | Transmission-Line Based Modeling for Conformal Shielding in Advanced System-in-Package (SiP) | C.-H. Chen; Y.-C. Tseng; I-C. Lin; C.-C. Fu; T.-L. Wu; TZONG-LIN WU | Asia-Pacific Symp. Electromagn. Compat. | 9 | 0 | |
2015 | Tri-Section Quarter Wavelength Resonator Common Mode Filter | C.-Y. Lin; Y.-C. Huang; T.-L. Wu; TZONG-LIN WU | Asia-Pacific Int. Symp. Electronmagn. Compat. | 5 | 0 | |
2016 | An Ultracompact TSV-Based Common-Mode Filter (TSV-CMF) in Three-Dimensional Integrated Circuits (3-D ICs) | C.-H. Cheng; T.-L. Wu; TZONG-LIN WU | IIEEE Transactions on Electromagnetic Compatibility | 27 | 27 | |
2014 | Very Closely Located Dual-band Frequency Selective Surfaces via Identical Resonant Elements | F.-C. Huang; C.-N. Chiu; T.-L. Wu; Y.-P. Chiou; TZONG-LIN WU ; YIH-PENG CHIOU | IEEE Antennas and Wireless Propagation Letters | 29 | 26 |