公開日期 | 標題 | 作者 | 來源出版物 | scopus | WOS | 全文 |
---|---|---|---|---|---|---|
2016 | An Ultracompact TSV-Based Common-Mode Filter (TSV-CMF) in Three-Dimensional Integrated Circuits (3-D ICs) | C.-H. Cheng; T.-L. Wu; TZONG-LIN WU | IIEEE Transactions on Electromagnetic Compatibility | 27 | 27 | |
2014 | Very Closely Located Dual-band Frequency Selective Surfaces via Identical Resonant Elements | F.-C. Huang; C.-N. Chiu; T.-L. Wu; Y.-P. Chiou; TZONG-LIN WU ; YIH-PENG CHIOU | IEEE Antennas and Wireless Propagation Letters | 29 | 26 |