Issue Date | Title | Author(s) | Source | scopus | WOS | Fulltext/Archive link |
---|---|---|---|---|---|---|
2004 | Power-Delivery Networks Optimization with Thermal Reliability Integrity | Ting-Yuan Wang; Jeng-Liang Tsai; |CHUNG-PING CHEN | ACM International Symposium on Physical Design (ISPD) | |||
2004 | SPICE-Compatible Thermal Simulation with Lumped Circuit Modeling for Thermal Reliability Analysis based on Model Reduction | Ting-Yuan Wang; CHUNG-PING CHEN | 5th International Symposium on Quality Electronic Design (ISQED) | |||
2004 | Thermal and Power Integrity based Power/Ground Networks Optimization | Ting-Yuan Wang; Jeng-Liang Tsai; CHUNG-PING CHEN | Design, Automation and Test in Europe Conference and Exhibition (DATE) | |||
2003 | Thermal-ADI: A Linear-Time Chip-Level Dynamic Thermal Simulation Algorithm Based on Alternating-Direction-Implicit (ADI) Method | Ting-Yuan Wang; CHUNG-PING CHEN | IEEE Transaction on Very Large Scale Integration Systems (TVLSI) | 39 | ||
2001 | Thermal-ADI: A Linear-Time Chip-Level Dynamic Thermal Simulation Algorithm Based on Alternating-Direction-Implicit (ADI) Method | Ting-Yuan Wang; CHUNG-PING CHEN | ACM International Symposium on Physical Design (ISPD) |