公開日期 | 標題 | 作者 | 來源出版物 | scopus | WOS | 全文 |
---|---|---|---|---|---|---|
2018 | Non-periodic flipped-SIR EBG for dual-band SSN mitigation in 2-layer PCB | Y.-C. Wang; H.-W. Chan; H.-C. Hsieh; Y.-H. Lin; W.-S. Wang; S.-H. Wang; R.-B. Wu; RUEY-BEEI WU | 2018 IEEE Electrical Design of Advanced Packaging and Systems | 1 | 0 | |
2018 | A novel dual sided fly-by topology for 1 to 8 DDR with optimized signal integrity by EBG design | C.-C. Chiu; K.-Y. Yang; Y.-H. Lin; W.-S. Wang; T.-Y. Wu; R.-B. Wu; RUEY-BEEI WU | IEEE Transactions on Components, Packaging, and Manufacturing Technology | 7 | 6 | |
2001 | NSTL evaluation of the compact EMC chamber with absorbers being partially lined on the floor ground | L.-R. Chen; Y.-H. Lin; TZONG-LIN WU | Electromagn. Compat. Conf. | |||
2002 | NSTL evaluation of the compact EMC chamber with ferrite tiles being partially lined on the floor ground | L.-R. Chen; Y.-H. Lin; TZONG-LIN WU | IEEE Int. Symp. Electromagn. Compat. | |||
2004 | Numerical and experimental investigation of radiation caused by the switching noise on the partitioned DC reference planes of high speed digital PCB | TZONG-LIN WU ; S.-T. Chen; J.-N. Huang; Y.-H. Lin | IEEE Transactions on Electromagnetic Compatibility | |||
2018 | Playlist-based tag propagation for improving music auto-tagging | Y.-H. Lin; C.-H. Chung; H. H. Chen; HOMER H. CHEN | European Signal Processing Conference (Eusipco) | 0 | 0 | |
2013 | Radio-Frequency Interference Mitigation Strategies for High-Speed Connectors | C.-Y. Hsiao; S.-H. Wang; C.-C Wang; W.-S. Wang; Y.-H. Lin; TZONG-LIN WU | Elect. Design Adv. Packag. Systems Symp. | |||
2001 | The effect of test system impedance on measurements of ground bounce in printed circuit boards | TZONG-LIN WU ; Y.-H. Lin; J.-N. Huang; J.-J. Lin | IEEE Transactions on Electromagnetic Compatibility | |||
2017 | Two-cap filter for routing noise suppression using extended EBG analysis | P.-C. Chen; K.-Y. Yang; T.-Y. Wu; W.-S. Wang; Y.-H. Lin; R.-B. Wu; RUEY-BEEI WU | IEEE Transactions on Components, Packaging, and Manufacturing Technology | 3 | 3 |