公開日期 | 標題 | 作者 | 來源出版物 | scopus | WOS | 全文 |
2008 | Large-area and thin light guide plates fabricated using UV-based imprinting | Huang, P.-H.; Huang, T.-C.; Sun, Y.-T.; Yang, S.-Y.; SEN-YEU YANG | Optics Express | 28 | 21 | |
2017 | Low-cost and rapid fabrication of metallic nanostructures for sensitive biosensors using hot-embossing and dielectric-heating nanoimprint methods | Lee, K.-L.; Wu, T.-Y.; Hsu, H.-Y.; Yang, S.-Y.; Wei, P.-K.; SEN-YEU YANG | Sensors (Switzerland) | 23 | 24 | |
2016 | Magnetic fluid microstructure curved surface uniform embossing and photocuring process technology | Chen, R.-H.; Weng, Y.-J.; Yang, S.-Y.; SEN-YEU YANG | Polymers for Advanced Technologies | 3 | 3 | |
2011 | Magnetic resonance imaging of hyperpolarized 3He Detected With a High-T<inf>c</inf> SQUID in microtesla magnetic field at laboratory environment fields | Chen, H.-H.; Yang, H.-C.; Horng, H.-E.; Liao, S.H.; Yang, S.-Y.; Chen, K.L.; Wang, L.M.; LI-MIN WANG | IEEE Transactions on Applied Superconductivity | 4 | 4 | |
2009 | A novel electromagnetism-assisted imprinting technology to replicate microstructures onto a large-area curved surface using a flexible magnetic mold | Weng, Y.-J.; Weng, Y.-C.; Yang, S.-Y.; Wong, J.-L.; SEN-YEU YANG | Polymers for Advanced Technologies | 9 | 9 | |
2018 | A novel flexible heating element using graphene polymeric composite ink on polyimide film | Ke, K.-C.; Cheng, C.; Lin, L.-J.; Yang, S.-Y.; SEN-YEU YANG | Microsystem Technologies | 3 | 3 | |
2008 | Novel hydrostatic pressuring mechanism for soft UV-imprinting processes | Cheng, F.-S.; Yang, S.-Y.; Chen, C.-C.; SEN-YEU YANG | Journal of Vacuum Science and Technology B: Microelectronics and Nanometer Structures | 10 | 10 | |
2009 | A novel magnetic nickel mold combined nano-particle fluid electromagnetism imprinting on replicating microstructures | Weng, Y.-J.; Weng, Y.-C.; Wong, Y.-C.; Yang, S.-Y.; SEN-YEU YANG | 2009 International Conference on Signal Processing Systems | 0 | 0 | |
2006 | novel method for rapid fabrication of a microlens array using micro transfer molding with soft mold | Chang, C.-Y.; Yang, S.-Y.; Huang, L.-S.; Jeng, T.-M. | J. Micromechanics and Microengineering | | | |
2006 | A novel method for rapid fabrication of microlens arrays using micro-transfer molding with soft mold | Chang, C.-Y.; Yang, S.-Y.; Huang, L.-S.; Jeng, T.-M.; SEN-YEU YANG | Journal of Micromechanics and Microengineering | 22 | 21 | |
2014 | Novel real-time temperature diagnosis of conventional hot-embossing process using an ultrasonic transducer | Cheng, C.-C.; Yang, S.-Y.; Lee, D.; SEN-YEU YANG | Sensors (Switzerland) | 9 | 8 | |
2017 | Optimization of heat-treatment parameters in hardening of titanium alloy Ti-6Al-4V by using the Taguchi method | Lee, K.-H.; Yang, S.-Y.; Yang, J.-G.; SEN-YEU YANG | International Journal of Advanced Manufacturing Technology | 7 | 5 | |
2008 | Polymer-ridge waveguide fabrication by gas-assisted UV embossing with a soft mold | Cheng, F.-S.; Huang, P.-Y.; Yang, S.-Y.; SEN-YEU YANG | International Polymer Processing | 0 | 0 | |
2010 | Production of bioenergy via the combined processes using radio-frequency plasma and catalysts | Tu, W.-K.; Chang, C.-Y.; Lin, C.-F.; Shie, J.-L.; Chang, C.-F.; Kuo, J.T.; Yang, S.-Y.; Hsi, C.-L.; Shaw, D.-G.; Lee, D.-J.; SEN-YEU YANG | Air and Waste Management Association's Annual Conference and Exhibition | 1 | | |
2018 | Pulse-Width and Temperature Effect on the Switching Behavior of an Etch-Stop-on-MgO-Barrier Spin-Orbit Torque MRAM Cell | Rahaman, S.Z.; Wang, I.-J.; Chen, T.-Y.; CHI-FENG PAI ; Wang, D.-Y.; Wei, J.-H.; Lee, H.-H.; Hsin, Y.-C.; Chang, Y.-J.; Yang, S.-Y.; Kuo, Y.-C.; Su, Y.-H.; Chen, Y.-S.; Huang, K.-C.; CHIH-I WU | IEEE Electron Device Letters | 29 | 23 | |
2007 | Rapid fabrication of ultraviolet-cured polymer microlens arrays by soft roller stamping process | Chang, C.-Y.; Yang, S.-Y.; Chu, M.-H.; SEN-YEU YANG | Microelectronic Engineering | 86 | 73 | |
2013 | Real-time diagnosis of gas-assisted hot embossing process by ultrasound | Cheng, C.-C.; Wu, C.-L.; Wu, K.-T.; Yang, S.-Y.; SEN-YEU YANG | Polymer Engineering and Science | 1 | 1 | |
2008 | Replication of microlens arrays by gas-assisted hot embossing | Hocheng, H.; Wen, T.-T.; Yang, S.-Y.; SEN-YEU YANG | Materials and Manufacturing Processes | 28 | 23 | |
2006 | Singular uniformity after reflow of varied-shaped flip chip solder bump on single substrate | Hsu, H.-J.; Huang, J.-T.; Chao, P.-S.; Wu, C.-S.; Shih, S.-H.; Yang, S.-Y.; SEN-YEU YANG | 2006 International Conference on Electronic Materials and Packaging | 1 | 0 | |
2020 | Size-Dependent Switching Properties of Spin-Orbit Torque MRAM with Manufacturing-Friendly 8-Inch Wafer-Level Uniformity | Rahaman, S.Z.; Su, Y.-H.; Chen, G.-L.; Chen, F.-M.; Wei, J.-H.; Hou, T.-H.; Sheu, S.-S.; CHIH-I WU ; Deng, D.-L.; Wang, I.-J.; Wang, D.-Y.; CHI-FENG PAI ; Hsin, Y.-C.; Yang, S.-Y.; Lee, H.-H.; Chang, Y.-J. | IEEE Journal of the Electron Devices Society | 11 | 13 | |