公開日期 | 標題 | 作者 | 來源出版物 | scopus | WOS | 全文 |
1992 | CAD/CAM 系統的選擇與評估 | Young, H.T.; Chen, Fun-Kuo; Yang, Sen-Yen | 機械工程會刊 | | | |
2007 | Characteristic Study of MHD Pump with Channel in Rectangular Ducts | Ho, J.E.; Young, H.T. | Journal of Marine Science and Technology | | | |
2009 | Characterization of dressing behaviors and optimization technique in chemical mechanical polishing | Chen, K.R.; Young, H.T.; Chen, K.R.; Young, H.T.; HONG-TSU YOUNG | ECS Transactions | | | |
2011 | Condition-based Shaft Faults Diagnosis with Empirical Mode Decomposition Method | Lin, W.Y.; Young, H.T.; HONG-TSU YOUNG | Proc. Instn Mech. Engrs., Part B, Journal of Engineering Manufacture, London | | | |
1995 | Cutting Forces Predictions for Face Milling Under Runout Conditions | Young, H.T. | The Chinese Journal of Mechanics | | | |
1996 | Cutting Temperature Responses to Flank Wear | Young, H.T. | International Journal on the Science and Technology of Friction | | | |
2014 | Design of Medical Robotic Navigation System Interface used in Biopsy | Chen, C.H.; Xiao, F.R.; Kuo, M.F.; Chiang, P.H.; Young, H.T.; HONG-TSU YOUNG | The 13th NTU - Kyoto U - U of Tsukuba Joint Mini-symposium 2014 | | | |
2006 | Development of Automatic 3D Profile Measuring System | Young, H.T.; Lin, W.Y. | Proc. SPIE | | | |
2010 | Does the Residual Stress of Backend Grinding Dominate the Warping Problems in Wafer Thinning Process | Chen, K.R.; Young, H.T.; HONG-TSU YOUNG | | | | |
2012 | Enhancement of Through Silicon VIA Sidewall Quality by Nanosecond Laser Pulses with Chemical Etching Process | Tang, C.W.; Tseng, S.C.; Young, H.T.; Li, K.M.; Yang, M.; Liao, H.C.; HONG-TSU YOUNG | Advanced Materials Research | | | |
1990 | Experimental Analysis of Milling Force Pulsation | Young, H.T. | Jounal of Chinese Society of Mechanical Engineers | | | |
1991 | An Experimental Investigation of Temperatures in Chip Formation | Young, H.T.; Liou, H. Y. | Journal of Chinese Society of Mechanical Engineers | | | |
2008 | An Experimental Investigation on Silicon Wafer Thinning Process | Lin, C.C.; Young, H.T.; Zhan, J.P. | Journal of the Chinese Society of Mechanical Engineers | | | |
2004 | A Five-axis Rough Machining Approach for Centrifugal Impeller | Young, H.T.; Chung, E. | The International Journal of Advanced Manufacturing Technology | | | |
2016 | The Image Quality Effect of Optical Path in Laser Processing System with Dynamic Focus Module | Ding, C.F.; Young, H.T.; HONG-TSU YOUNG | the 5th International Conference on Nanomanufacturing (nanoMan 2016) | | | |
2015 | Improvement of Silicon Substrate Strength by an Application of Semiconductor Metallization Process | Chen, Y.J.; Tang, C.W; Young, H.T.; Gou M.H.; HONG-TSU YOUNG | International Manufacturing Conference in China (IMCC 2015) | | | |
2012 | Innovative through-silicon-via formation approach for wafer-level packaging applications | Tang, C.W.; Young, H.T.; Li, K.M.; Tang, Chao Wei; Young, Hong Tsu; Li, Kuan Ming; HONG-TSU YOUNG ; KUAN-MING LI | Journal of Micromechanics and Microengineering | | | |
1993 | An Integrated Expert Operation Planning System with Feature-Based Design Model | Young, H.T.; Tsai, D. H. | The International Journal, Advanced Manufacturing Technology | | | |
1994 | An Integrated Expert Operation Planning System with Feature-Based Design Model | Young, H.T.; Tsai, D.H. | International Journal of Advanced Manufacturing Technology | | | |
2003 | An Integrated Machining Approach for a Centrifugal Impeller | Young, H.-T.; Young, H.T.; Chuang, L.-C.; Chung, E.; YoungHT | International Journal of Advanced Manufacturing Technology | | | |