公開日期 | 標題 | 作者 | 來源出版物 | scopus | WOS | 全文 |
---|---|---|---|---|---|---|
2014 | Thermal Stress of Surface Oxide Layer on Micro Solder Bumps During Reflow | Key Chung C.; Zhu Z.X.; C. ROBERT KAO | Journal of Electronic Materials | |||
2013 | Volume shrinkage induced by interfacial reactions in micro joints | Li C.C.; Zhu Z.X.; Chen M.H.; C. ROBERT KAO | International Symposium on Advanced Packaging Materials |