公開日期 | 標題 | 作者 | 來源出版物 | scopus | WOS | 全文 |
2008 | Delaunay–Voronoi Modeling of Power-Ground Planes With Source Port Correction | K.-B. Wu; G.-H. Shiue; W.-D. Guo; C.-M. Lin; R.-B. Wu; RUEY-BEEI WU | IEEE Transactions on Advanced Packaging | 43 | 33 | |
2010 | Design and modeling of microstrip line to substrate integrated waveguide transitions,” in Microwave and Millimeter Wave Technologies | T.-Y. Huang; T.-M. Shen; R.-B. Wu; RUEY-BEEI WU | | | | |
2012 | Design considerations for radio frequency 3DICs | Y.-C. Tseng; C.-B. Chang; C.-K. Tang; C.-H. Cheng; Y.-C. Lu; K.-Y. Lin; T.-L. Wu; R.-B. Wu; YI-CHANG LU ; TZONG-LIN WU ; RUEY-BEEI WU ; KUN-YOU LIN | IEEE Elect. Design Adv. Packag. Systems Symp. | 0 | 0 | |
2013 | Design of a 180° hybrid with Chebyshev filtering response using coupled resonators | W.-R. Liu; R.-B. Wu; RUEY-BEEI WU | 2013 IEEE MTT-S International Microwave Symposium | 17 | 0 | |
2006 | Design of a Vertically stacked waveguide filter with novel cross coupling structures in LTCC | T.-M. Shen; T.-Y. Hung; C.-F. Chen; R.-B. Wu; RUEY-BEEI WU | 2006 Asia-Pacific Microwave Conference, APMC | 7 | 0 | |
2015 | Design of compact microwave filter using vertically interdigitated resonators | C.-Y. Tung; T.-Y. Huang; H.-Y. Tsai; R.-B. Wu; RUEY-BEEI WU | 2015 Asia-Pacific Microwave Conference | 0 | 0 | |
2011 | Design of compact triple- passband quasi-elliptic microstrip filters with multi-order spurious mode suppression | C.-F. Chen; T.-M. Shen; T.-Y. Huang; R.-B. Wu; RUEY-BEEI WU | Asia Pacific Microwave Conference | 0 | | |
2011 | Design of compact triple-band branch-line coupler with three arbitrary operating frequencies | Y.-L. Lin; T.-Y. Huang; T.-M. Shen; C.-C. Chen; R.-B. Wu; RUEY-BEEI WU | Asia Pacific Microwave Conference | 5 | | |
2014 | Design of dual-mode tunable filter with constant fractional bandwidth using varactors | H.-Y. Tsai; T.-Y. Huang; R.-B. Wu; RUEY-BEEI WU | 2014 Asia-Pacific Microwave Conference | 1 | | |
2009 | Design of lumped rat-race coupler in multilayer LTCC | T.-M. Shen; C.-R. Chen; T.-Y. Huang; R.-B. Wu; RUEY-BEEI WU | 2009 Asia-Pacific Microwave Conference | 18 | 0 | |
2011 | Design of microstrip-to-microstrip via transition in multi-layered LTCC for frequencies up to 67GHz | C.-C. Tsai; Y.-S. Cheng; T.-Y. Huang; A. Y. P. Hsu; R.-B. Wu; RUEY-BEEI WU | IEEE Transactions on Components, Packaging and Manufacturing Technology | 51 | 40 | |
2013 | Design of miniaturized filtering power dividers for system-in-a-package | C. F. Chen; T.-Y. Huang; T.-M. Shen; R.-B. Wu; RUEY-BEEI WU | IEEE Transactions on Components, Packaging, and Manufacturing Technology | 109 | 105 | |
2009 | Design of miniaturized vertically stacked SIW filters in LTCC | T.-Y. Huang; T.-M. Shen; H.-Y. Chien; R.-B. Wu; RUEY-BEEI WU | European Microwave Week 2009, EuMW 2009: Science, Progress and Quality at Radiofrequencies - 39th European Microwave Conference, EuMC | 12 | 0 | |
2011 | Design of quadruple-passband microwave filters using frequency transformation | W.-C. Lin; W.-L. Tsai; T.-Y. Huang; R.-B. Wu; RUEY-BEEI WU | 30th URSI General Assembly and Scientific Symposium, URSIGASS 2011 | 0 | 0 | |
2009 | Design of shorting vias in alternative PCB planes for suppressing ground-bounce induced electromagnetic emission | K.-B. Wu; F.-S. Chang; R.-B. Wu; RUEY-BEEI WU | 2009 IEEE 18th Conference on Electrical Performance of Electronic Packaging and Systems, EPEPS '09 | 1 | 0 | |
2013 | Design of single branch laminated waveguide diplexers using modal orthogonality | W.-L. Tsai; T.-M. Shen; B.-J. Chen; R.-B. Wu; RUEY-BEEI WU | IEEE Transactions on Microwave Theory and Techniques | 27 | 26 | |
2009 | Design of tri-band filters with improved band allocation | B.-J. Chen; T.-M. Shen; R.-B. Wu; RUEY-BEEI WU | IEEE Transactions on Microwave Theory and Techniques | 59 | 63 | |
2016 | Design of varactor-tuned dual-mode tunable filter with constant fractional bandwidth | H.-Y. Tsai; T.-Y. Huang; R.-B. Wu; RUEY-BEEI WU | IEEE Transactions on Components, Packaging, and Manufacturing Technology | | | |
2006 | Design of wideband impedance matching for through-hole via transition using ellipse-shaped anti-pad | W.-D. Guo; W.-N. Chine; C.-L. Wang; G.-H. Shiue; R.-B. Wu; RUEY-BEEI WU | 14th Topical Meeting on Electrical Performance of Electronic Packaging, EPEP | 18 | 0 | |
2008 | Designs of signal-ground bump-patterns for minimizing the simultaneous switching noise in a ball grid array | R.-B. Sun; C.-M. Lin; R.-B. Wu; RUEY-BEEI WU | IEEE 17th Topical Meeting on Electrical Performance of Electronic Packaging | 3 | 0 | |