公開日期 | 標題 | 作者 | 來源出版物 | scopus | WOS | 全文 |
2010 | Guard trace design for improvement on transient waveforms and eye diagrams of serpentine delay lines | G.-H. Shiue; C.-Y. Chao; W.-D. Guo; R.-B. Wu; RUEY-BEEI WU | IEEE Transactions on Advanced Packaging | 24 | 20 | |
2013 | Heat dissipation analysis and design of a board-level phased-array transmitter module for 60-GHz Communication | H.-C. Cheng; W.-R. Ciou; W.-H. Chen; J.-L. Kuo; H.-C. Lu; R.-B. Wu; HSIN-CHIA LU ; RUEY-BEEI WU | Applied Thermal Engineering | 12 | 11 | |
2006 | Hybrid TIE/FDTD method for open boundary coupling between isolation islands | C. T. Wu; R.-B. Wu; RUEY-BEEI WU | IEEE Transactions on Advanced Packaging | 1 | 1 | |
2005 | Ka-band 32-GHz planar integrated switched-beam smart antenna | A.-S. Liu; H.-S. Wu; C.-K. C. Tzuang; R.-B. Wu; RUEY-BEEI WU | IEEE MTT-S International Microwave Symposium Digest, 2005. | 10 | 0 | |
2011 | LTCC embedded laminated waveguide filters and couplers for microwave SiP applications | T.-Y. Huang; T.-M. Shen; R.-B. Wu; RUEY-BEEI WU | 2011 Electronic Design of Advanced Packaging and Systems | 1 | 0 | |
2006 | Microstrip diplexers design with common resonator sections for compact size, but high isolation | C. F. Chen; F. Y. Huang; C. P. Chou; R.-B. Wu; RUEY-BEEI WU | IEEE Transactions on Microwave Theory and Techniques | 253 | 220 | |
2013 | Millimeter-wave non-contact flip-chip Transitions with Chebyshev filtering response using coupled microstrip resonators | H.-Y. Tsai; T.-Y. Huang; T.-M. Shen; R.-B. Wu; RUEY-BEEI WU | Asia-Pacific Microwave Conference | 1 | 0 | |
2006 | Miniaturized microstrip quasi-elliptical bandpass filters using slotted resonators | C.-F. Chen; T.-Y. Huang; R.-B. Wu; RUEY-BEEI WU | 2006 IEEE International Microwave Symposium | 9 | 0 | |
2009 | Miniaturized rat-race coupler with bandpass response and good stopband rejection | W.-H. Wang; T.-M. Shen; T.-Y. Huang; R.-B. Wu; RUEY-BEEI WU | 2009 IEEE MTT-S International Microwave Symposium | 42 | 0 | |
2005 | Model-based optimization method for bandwidth enhancement of a series-fed printed dipole antenna array | Y. H. Liu; A. S. Liu; Y. H. Pang; Y. C. Lin; R.-B. Wu; C. C. Chen; RUEY-BEEI WU | Bulletin of the College of Engineering, NTU | | | |
2014 | Modeling and fast eye- diagram estimation of ringing effects on branch line structures | K.-Y. Yang; T.-Y. Wu; W.-S. Wang; Y.-H. Lin; R.-B. Wu; RUEY-BEEI WU | IEEE Transactions on Components, Packaging, and Manufacturing Technology | 1 | 1 | |
2008 | Multilayer 180° hybrid in LTCC | T.-M. Shen; T.-Y. Hung; R.-B. Wu; RUEY-BEEI WU | 2008 Asia-Pacific Microwave Conference | 5 | 0 | |
2018 | Non-periodic flipped-SIR EBG for dual-band SSN mitigation in 2-layer PCB | Y.-C. Wang; H.-W. Chan; H.-C. Hsieh; Y.-H. Lin; W.-S. Wang; S.-H. Wang; R.-B. Wu; RUEY-BEEI WU | 2018 IEEE Electrical Design of Advanced Packaging and Systems | 1 | 0 | |
2006 | Novel compact net-type resonators and their applications to microstrip bandpass filters | C.-F. Chen; T.-Y. Huang; R.-B. Wu; RUEY-BEEI WU | IEEE Transactions on Microwave Theory and Techniques | 49 | 43 | |
2018 | A novel dual sided fly-by topology for 1 to 8 DDR with optimized signal integrity by EBG design | C.-C. Chiu; K.-Y. Yang; Y.-H. Lin; W.-S. Wang; T.-Y. Wu; R.-B. Wu; RUEY-BEEI WU | IEEE Transactions on Components, Packaging, and Manufacturing Technology | 7 | 6 | |
2018 | Novel RDL design of wafer-level packaging for signal/power integrity in LPDDR4 application | K.-B. Wu; T.-Y. Kuo; B. Hung; B. Lin; C. Peng; M.-T. Yang; R.-B. Wu; RUEY-BEEI WU | IEEE Transactions on Components, Packaging, and Manufacturing Technology | 10 | 6 | |
2011 | Optimal decoupling capacitors design for suppressing edge radiation of power/ground planes | K.-W. Li; K.-B. Wu; R.-B. Wu; RUEY-BEEI WU | IEEE 20th Topical Meeting on Electrical Performance of Electronic Packaging | 3 | 0 | |
2010 | Optimization of FIR filter to improve eye diagram for general transmission line systems | Y.-S. Cheng; Y.-C. Lai; R.-B. Wu; RUEY-BEEI WU | Design, Automation, and Test in Europe Conference | 6 | 0 | |
2011 | Passive equalizer design for through silicon vias with perfect compensation | R.-B. Sun; C.-Y. Wen; R.-B. Wu; RUEY-BEEI WU | IEEE Transactions on Components, Packaging, and Manufacturing Technology | 20 | 16 | |
2011 | Passive FIR filter design using reflections from stubs for high speed links | Y.-S. Cheng; R.-B. Wu; RUEY-BEEI WU | 2011 Electrical Design of Advanced Packaging and Systems | 0 | 0 | |