公開日期 | 標題 | 作者 | 來源出版物 | scopus | WOS | 全文 |
---|---|---|---|---|---|---|
2006 | An efficient and flexible modeling for power/ground planes | K.-B. Wu; G.-H. Shiue; W.-D. Guo; C.-M. Lin; R.-B. Wu; RUEY-BEEI WU | 14th Topical Meeting on Electrical Performance of Electronic Packaging, EPEP | 1 | 0 | |
2007 | An integrated signal and power integrity analysis for signal traces through the parallel planes using hybrid finite-element and finite-difference time-domain techniques | W.-D. Guo; G.-H. Shiue; C.-M. Lin; RUEY-BEEI WU | IEEE Transactions on Advanced Packaging | 18 | 15 | |
2005 | Combined FDTD/FETD algorithm for ground bounce characterization of differential traces through the planes | W.-D. Guo; G.-H. Shiue; C.-M. Lin; R.-B. Wu; RUEY-BEEI WU | IEEE 14th Topical Meeting on Electrical Performance of Electronic Packaging | 0 | 0 | |
2006 | Comparisons between serpentine and flat spiral delay lines on transient reflection/transmission waveforms and eye diagrams | W.-D. Guo; G.-H. Shiue; C.-M. Lin; RUEY-BEEI WU | IEEE Transactions on Microwave Theory and Techniques | 43 | 40 | |
2008 | Delaunay–Voronoi Modeling of Power-Ground Planes With Source Port Correction | K.-B. Wu; G.-H. Shiue; W.-D. Guo; C.-M. Lin; R.-B. Wu; RUEY-BEEI WU | IEEE Transactions on Advanced Packaging | 43 | 33 | |
2008 | Designs of signal-ground bump-patterns for minimizing the simultaneous switching noise in a ball grid array | R.-B. Sun; C.-M. Lin; R.-B. Wu; RUEY-BEEI WU | IEEE 17th Topical Meeting on Electrical Performance of Electronic Packaging | 3 | 0 |