公開日期 | 標題 | 作者 | 來源出版物 | scopus | WOS | 全文 |
---|---|---|---|---|---|---|
2008 | A novel stopband-enhanced EBG planes using an embedded slow-wave structure | C.-Y. Hsieh; H.-H. Chuang; T.-K. Wang; C.-C. Wang; H.-H. Cheng; Y.-S. Wu; C.-T. Chiu; C.-P. Hung; T.-L. Wu; TZONG-LIN WU | Elect. Performance Electron. Packag. Systems | 5 | 0 | |
2004 | A novel time-domain algorithm for synthesizing broadband macromodels of coupled interconnects | C.-C. Kuo; C.-C. Wang; S.-M. Wu; C.-P. Hung; TZONG-LIN WU | IEEE Transactions on Advanced Packaging | 2 | 2 | |
2004 | Chip-level model of switching noise coupling on integrated system combining package and printed circuit board | S.-T. Chen; C.-W. Tsai; S.-M. Wu; C.-P. Hung; T.-L. Wu; TZONG-LIN WU | IEEE Int. Symp. Electromagn. Compat. Eur. Workshop | |||
2003 | Coupling effect of ground bounce noise for ball grid array (BGA) package mounted on printed circuit boards (PCB) | S.-T. Chen; C.-W. Tsai; S.-M. Wu; C.-P. Hung; T.-L. Wu; TZONG-LIN WU | Taiwan Electromagn. Compat. Conf. | |||
2010 | Enhanced microstrip guard trace for ringing noise suppression using a dielectric superstrate | Y.-S. Cheng; W.-D. Guo; C.-P. Hung; RUEY-BEEI WU ; D. De Zutter | IEEE Transactions on Advanced Packaging | 26 | 16 |