公開日期 | 標題 | 作者 | 來源出版物 | scopus | WOS | 全文 |
---|---|---|---|---|---|---|
2015 | A New Broadband Common-Mode Noise Absorption Circuit for High-Speed Differential Digital Systems | C.-Y. Hsiao; C.-H. Cheng; T.-L. Wu; TZONG-LIN WU | IEEE Transactions on Microwave Theory and Techniques | 57 | 53 | |
2014 | A novel common-mode filter (CMF) design based on signal interference technique | C.-H. Hung; C.-Y. Hsiao; T.-L. Wu; TZONG-LIN WU | IEEE Electrical Design of Advanced Packaging & Systems Symposium (EDAPS) | 2 | 0 | |
2014 | A novel dual-function circuit combining high-speed differential equalizer and common-mode filter with an additional zero | C.-Y. Hsiao; T.- L. Wu; TZONG-LIN WU | IEEE Microwave and Wireless Components Letters | 11 | 9 | |
2015 | A SMD-Type Filter Solution for EMI/RFI Mitigation on High-Speed Digital Interfaces and Its Application | Y.-J. Lin; Y.-C. Tseng; C.-Y. Hsiao; T.-L. Wu; TZONG-LIN WU | Asia-Pacific Symp. Electromagn. Compat. | 2 | 0 | |
2015 | An Ultra-Compact Common-Mode Bandstop Filter With Modified-T Circuits in Integrated Passive Device (IPD) Process | C.-Y. Hsiao; Y.-C. Huang; T.-L. Wu; TZONG-LIN WU | IEEE Transactions on Microwave Theory and Techniques | 46 | 39 | |
2010 | Conformal shielding investigation for SiP modules | C.-H. Huang; C.-Y. Hsiao; C.-D Wang; T. Chen; K.-H. Liao; T.-L. Wu; TZONG-LIN WU | Elect. Design Adv. Packag. Systems Symp. | 13 | 0 | |
2011 | Mold-based compartment shielding to mitigate the intra-system coupled noise on SiP modules | C.-Y. Hsiao; C.-H. Huang; C.-D. Wang; K.-H. Liao; C.-H. Shen; C.-C. Wang; T.-L. Wu; TZONG-LIN WU | IEEE. Int. Symp. Electromagn. Compat. | 17 | 0 | |
2012 | Radiation suppression for cable-attached packages utilizing a compact embedded common-mode filter | C.-Y. Hsiao; C.-H. Tsai; C.-N. Chiu; T.-L. Wu; TZONG-LIN WU | IEEE Transactions on Components, Packaging and Manufacturing Technology | 65 | 59 | |
2013 | Radio-Frequency Interference Mitigation Strategies for High-Speed Connectors | C.-Y. Hsiao; S.-H. Wang; C.-C Wang; W.-S. Wang; Y.-H. Lin; T.-L. Wu; TZONG-LIN WU | Elect. Design Adv. Packag. Systems Symp. | 6 | 0 |