公開日期 | 標題 | 作者 | 來源出版物 | scopus | WOS | 全文 |
---|---|---|---|---|---|---|
2009 | A new isolation structure for crosstalk reduction for pogo pins in a test socket | R.-B. Sun; C.-Y. Wen; Y.-C. Chang; R.-B. Wu; RUEY-BEEI WU | 2009 IEEE 18th Conference on Electrical Performance of Electronic Packaging and Systems, EPEPS '09 | 5 | 0 | |
2011 | A new isolation structure of pogo pins for crosstalk reduction in a test socket | R.-B. Sun; C.-Y. Wen; R.-B. Wu; RUEY-BEEI WU | IEEE Transactions on Components, Packaging and Manufacturing Technology | 12 | 11 | |
2004 | Experimental and Numerical study of separation angle for the flow around a circular cylinder at low Reynolds number | M.-H. Wu; C.-Y. Wen; R-H. Yen; M.-C. Weng; A.–B. Wang; AN-BANG WANG | Proceedings of the 57th Annual Meeting of the Division of Fluid Dynamics (AN005) | |||
2011 | Passive equalizer design for through silicon vias with perfect compensation | R.-B. Sun; C.-Y. Wen; R.-B. Wu; RUEY-BEEI WU | IEEE Transactions on Components, Packaging, and Manufacturing Technology | 20 | 16 | |
2010 | RC passive equalizer for through silicon via | R.-B. Sun; C.-Y. Wen; R.-B. Wu; RUEY-BEEI WU | 2010 IEEE 19th Conference on Electrical Performance of Electronic Packaging and Systems, EPEPS 2010 | 4 | 0 |